HP 441877-00F Bedienungsanleitung PDF herunterladen (Seite 54)

Diagnostics 54

This tests the external link connection. For the fiber medium, this is simply another external loopback

test. For the copper medium, this is not applicable.

Group B: Memory tests

Various patterns (0x55aa55aa, 0xaa55aa55, & address) are used to test each of the memory blocks.

• B1. TXP scratchpad

• B2. TPAT scratchpad

• B3. RXP scratchpad

• B4. COM scratchpad

• B5. CP scratchpad

• B6. MCP scratchpad

• B7. TAS header buffer

• B8. TAS payload buffer

• B9. RBUF via GRC

• B10. RBUF via indirect access

• B11. RBUF Cluster list

• B12. TSCH list

• B13. CSCH List

• B14. RV2P scratchpads

• B15. TBDC memory

• B16. RBDC memory

• B17. CTX page table

• B18. CTX memory

Group C: Block tests

• C1. CPU logic and DMA interface tests

The tests check the basic logic functionalities of each of the on-chip CPUs. The tests also cover the

DMA interface exposed to the CPUs. These tests require the presence of a test firmware file inside

the “diagfw” directory.

• C2. RBUF allocation test

This tests the Rx buffer allocation interface.

• C3. CAM access test

This tests read, write, add, modify, and cache hit functionalities of the associative memory.

• C4. TPAT cracker test

This tests the packet cracking logic block as well as the checksum/CRC offload logic. This test

requires the presence of a test firmware file inside the “diagfw” directory.

• C5. FIO register test

This is another register test dedicated for register interface only exposed to the internal CPUs. This

test requires the presence of the test firmware files in the “diagfw” directory.

1 2 ... 49 50 51 52 53 54 55 56 57 58 59 ... 66 67

Keine Kommentare

HP 441877-00F Bedienungsanleitung Seite 54