Hp ProLiant ML370 G5 Server Bedienungsanleitung Seite 46
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Hardware options installation 46
memory read on one memory board returns incorrect data due to an uncorrectable memory error, the
system automatically retrieves the proper data from the other memory board. A memory board is not
necessarily disabled (thus losing mirroring protection) because of a single uncorrectable error. Mirroring
protection is not lost due to transient and soft uncorrectable errors, resulting in systems that maintain
mirroring protection (and thus improved uptime) unless there is a true FBDIMM failure.
Because both memory boards are active, concurrent reads from both memory boards at the same time are
possible. Therefore, mirroring provides superior read performance compared to all other Advanced
Memory Protection modes.
Mirrored memory allows the server to keep two copies of all memory data on separate memory boards. If
an uncorrectable error is encountered, the proper data is retrieved from the memory board that does not
contain the error. There is no negative performance impact from using mirrored memory.
In addition to general configuration requirements ("FBDIMM installation guidelines" on page 48),
mirrored memory has the following FBDIMM configuration requirements:
• Memory board 1 and memory board 2 must both be populated.
• Memory board 1 and memory board 2 must have identical memory configurations.
• Each bank of memory board 1 must be populated using FBDIMMs with identical HP part numbers to
the corresponding bank of memory board 2.
• Mirrored memory does not support any hot-plug operations.
In mirroring mode, FBDIMMs must be populated as specified in the following table.
Mirrored memory configurations (both memory boards must be installed with the same configuration):
Memory board
configuration
Bank A
1A and 5A
Bank B
2B and 6B
Bank C
3C and 7C
Bank D
4D and 8D
1 X — — —
2 X X — —
3 X X X —
4 X X X X
After installing FBDIMMs, use RBSU to configure the system for online spare memory support
("Configuring online spare memory" on page 83).
Memory boards and FBDIMMs
The server utilizes two memory boards. Each memory board consists of eight slots, numbered sequentially.
The paired banks are identified by the letters A through D. Each memory board supports 2x1 interleaving.
For maximum performance, HP recommends that both memory boards be populated with the same total
amount of memory to support 4x1 interleaving across both memory branches.
Observe the following warnings when performing a replacement procedure:
WARNING: Always comply with all electrostatic and thermal guidelines to prevent bodily
injury and ensure a properly functioning system when performing hot-plug operations.
- User Guide 1
- Audience assumptions 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Item Description Status 9
- Systems Insight Display LEDs 10
- Rear panel components 11
- Rear panel LEDs 12
- System board components 13
- System maintenance switch 14
- SAS and SATA device numbers 15
- SAS and SATA hard drive LEDs 16
- Online/activity 17
- LED (green) 17
- Fault/UID LED 17
- (amber/blue) 17
- Interpretation 17
- FBDIMM slots 18
- Power supply backplane LED 19
- Fan locations 19
- Operations 20
- Operations 21 21
- Operations 22 22
- Remove the rack bezel 23
- Operations 24 24
- Install the rack bezel 25
- Remove the access panel 25
- Install the access panel 26
- Remove the center wall 27
- Rack planning resources 28
- Optimum environment 29
- Temperature requirements 30
- Power requirements 30
- Rack warnings 31
- Server warnings and cautions 31
- Setup 32 32
- Installing hardware options 33
- Setting up a tower server 33
- Setup 34 34
- Registering the server 35
- Introduction 36
- Processor option 36
- 13. Install the heatsink 41
- 15. Install the PPM 41
- Memory options 42
- Advanced ECC memory 43
- Online spare memory 44
- Mirrored memory 45
- Memory boards and FBDIMMs 46
- Removing FBDIMMs 48
- Installing FBDIMMs 49
- Hot-plug hard drive options 50
- Remove the hard drive blank 51
- Prepare the hard drive 51
- Expansion board options 61
- Performance balancing 62
- Expansion slot cover 62
- Installing expansion boards 63
- Removing expansion boards 64
- • Rack rails 67
- • Cable management arm 67
- • Server rails 67
- • Rack bezel 67
- Remove the CD-ROM drive 69
- Install the center wall 74
- Cabling 75
- SAS cabling 76
- CD-ROM drive cabling 77
- Video cabling 78
- Parallel/serial port cabling 78
- Diskette drive cabling 79
- BBWC option cabling 79
- Internal USB connector 80
- Configuration and utilities 81
- HP ROM-Based Setup Utility 82
- Boot options 83
- BIOS Serial Console 83
- Configuring mirrored memory 83
- Array Configuration Utility 84
- Auto-configuration process 84
- Management tools 86
- Management Agents 88
- HP Systems Insight Manager 88
- Redundant ROM support 88
- USB support 89
- Diagnostic tools 90
- Integrated Management Log 91
- Keeping the system current 92
- Care Pack 93
- Battery replacement 94
- Battery replacement 95 95
- Troubleshooting 96
- Symbols on equipment 97
- Warnings and cautions 97
- Symptom information 98
- Loose connections 99
- Service notifications 100
- Troubleshooting flowcharts 100
- General diagnosis flowchart 101
- Symptoms: 103
- Troubleshooting 105 105
- POST problems flowchart 106
- OS boot problems flowchart 107
- • Redundancy failure 110
- Troubleshooting 111 111
- Electrostatic discharge 112
- FCC rating label 113
- Class A equipment 113
- Class B equipment 113
- Modifications 114
- • EMC Directive 2004/108/EC 115
- Japanese notice 116
- BSMI notice 116
- Korean notice 117
- Laser compliance 117
- Battery replacement notice 117
- Specifications 119
- Specification Value 120
- Technical support 121
- Customer Self Repair 122
- Technical support 124 124
- Reparo feito pelo cliente 126
- Technical support 127 127
- Technical support 128 128
- Acronyms and abbreviations 129
- Index 132 132
- Index 133 133
- Index 134 134
- Index 135 135
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