Hp ProLiant DL580 G7 Server Bedienungsanleitung

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HP ProLiant DL580 G7 Server
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Part Number: 595656-005
July 2012
Edition: 5
Seitenansicht 0
1 2 3 4 5 6 ... 130 131

Inhaltsverzeichnis

Seite 1 - User Guide

HP ProLiant DL580 G7 Server User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage sys

Seite 2

Component identification 10 Rear panel components Item Description Item Description 1 Power supply bay 4 (optional) 15 Expansion slot

Seite 3 - Contents

Troubleshooting 100 Server fault indications flowchart Symptoms: • Server boots, but a fault event is reported by Insight Management Agents • Se

Seite 4 - Contents 4

Troubleshooting 101 Possible causes: • Improperly seated or faulty internal or external component • Unsupported component installed • Redundancy

Seite 5 - Contents 5

Troubleshooting 102 POST error messages and beep codes For a complete listing of error messages, refer to the "POST error messages" in t

Seite 6 - Contents 6

Troubleshooting 103 WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before r

Seite 7 - Component identification

Battery replacement 104 Battery replacement If the server no longer automatically displays the correct date and time, you may need to replace the ba

Seite 8 - Front panel LEDs and buttons

Regulatory compliance notices 105 Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory complianc

Seite 9 - Systems Insight Display

Regulatory compliance notices 106 radio communications. However, there is no guarantee that interference will not occur in a particular installation

Seite 10 - Rear panel components

Regulatory compliance notices 107 This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.

Seite 11 - Rear panel LEDs and buttons

Regulatory compliance notices 108 This symbol on the product or on its packaging indicates that this product must not be disposed of with your othe

Seite 12 - Power supply LED

Regulatory compliance notices 109 Class B equipment Chinese notice Class A equipment Laser compliance This product may be provided with an optic

Seite 13 - System board components

Component identification 11 Rear panel LEDs and buttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing—Ne

Seite 14 - NMI jumper

Regulatory compliance notices 110 Batteries, battery packs, and accumulators should not be disposed of together with the general household waste.

Seite 15 - SPI board components

Regulatory compliance notices 111 WARNING: Exposure to Radio Frequency Radiation—The radiated output power of this device is below the FCC radio f

Seite 16

Regulatory compliance notices 112 Taiwan notices

Seite 17 - Component identification 17

Electrostatic discharge 113 Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions y

Seite 18 - Device numbers

Specifications 114 Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shi

Seite 19 - Hard drive LED combinations

Specifications 115 HP ProLiant 1200 W power supply specifications Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200

Seite 20 - Battery pack LEDs

Support and other resources 116 Support and other resources Before you contact HP Be sure to have the following information available before you cal

Seite 21

Support and other resources 117 providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship

Seite 22 - FBWC module LEDs

Support and other resources 118 Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'i

Seite 23 - Fan locations

Support and other resources 119 HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen

Seite 24 - Item Description

Component identification 12 Power supply LED Power LED Status Off No AC power to power supply units. Check the AC power cord. Off AC i

Seite 25 - Operations

Support and other resources 120 sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes

Seite 26 - Remove the access panel

Support and other resources 121 Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pe

Seite 27

Support and other resources 122

Seite 28

Support and other resources 123

Seite 29 - Remove the SPI board

Acronyms and abbreviations 124 Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility AMP Advanced Memory Protection ASR A

Seite 30 - Operations 30

Acronyms and abbreviations 125 KVM keyboard, video, and mouse NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral c

Seite 31 - Optimum environment

Acronyms and abbreviations 126 SDDC Single Device Data Correction SFF small form factor SIM Systems Insight Manager SMI Scalable memory interface

Seite 32 - Temperature requirements

Documentation feedback 127 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documenta

Seite 33 - Rack warnings

Index 128 A AC power supply 115 access panel 26 acoustics statement for Germany 110 ACU (Array Configuration Utility) 78 additional informat

Seite 34 - Installing hardware options

Index 129 extending server from rack 25 external health LED 8 F fans 23 FBWC module 22, 68 FCC rating label 105 features 7 Federal Commu

Seite 35 - Registering the server

Component identification 13 System board components Item Description 1 Optional I/O expansion board connectors: • PCI-X/PCI Express I/O ex

Seite 36 - Processor options

Index 130 O online spare memory 77 operating systems 35, 84 operations 25 optimum environment 31 Option ROM Configuration for Arrays (ORCA)

Seite 37

Index 131 SmartStart, overview 75 space requirements 32 specifications, environmental 114 specifications, server 114 SPI (System Peripheral

Seite 38

Component identification 14 System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system conf

Seite 39

Component identification 15 SPI board components Item Description 1 Mini-SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data c

Seite 40

Component identification 16 I/O expansion board components • PCI-X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (16, 8

Seite 41

Component identification 17 **Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots. Processors and memory cartridges

Seite 42

Component identification 18 DIMM slot locations Each memory cartridge contains 8 DIMM slots. The lockstep banks are identified by the letters A thro

Seite 43 - Memory options

Component identification 19 Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations

Seite 44 - DIMM installation guidelines

© Copyright 2010, 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warr

Seite 45

Component identification 20 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Off Steadily amber A critical fault condition has

Seite 46

Component identification 21 LED3 pattern LED4 pattern Interpretation Off Flashing (2 Hz) The system is powered down, and the cache contains

Seite 47 - Hemisphere mode

Component identification 22 FBWC module LEDs The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse sid

Seite 48

Component identification 23 Fan locations Power supply backplane components

Seite 49 - Memory RAS

Component identification 24 Item Description 1 Graphics card power connector 2 Graphics card power connector 3 Graphics card power connector 4

Seite 50

Operations 25 Operations Power up the server To power up the server, press the Power On/Standby button. Power down the server WARNING: To reduc

Seite 51 - Installing DIMMs

Operations 26 2. Extend the server on the rack rails until the server rail-release latches engage. 3. After performing the installation or maint

Seite 52

Operations 27 2. Extend the server from the rack (on page 25). 3. Open the locking latch, slide the access panel to the rear of the chassis, and re

Seite 53 - Hot-plug hard drive option

Operations 28 3. Release the latches on the release lever. 4. Lower the handle, and then extend the processor memory drawer from the server until

Seite 54

Operations 29 2. After the display fully ejects, rotate the display downward to view the LEDs. Remove the SPI board To remove the component: 1. P

Seite 55

Contents 3 Contents Component identification ...

Seite 56

Operations 30 5. Raise the levers, and lift the SPI board from the server. 6. Remove all components from the failed SPI board. To replace the comp

Seite 57 - Expansion board options

Setup 31 Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and

Seite 58

Setup 32 Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when decid

Seite 59 - Remove the shipping screws

Setup 33 Power requirements Installation of this equipment must comply with local and regional electrical regulations governing the installation of

Seite 60

Setup 34 WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor.

Seite 61

Setup 35 To configure these utilities manually: • Press the F8 key when prompted during the array controller initialization to configure the array

Seite 62

Hardware options installation 36 Hardware options installation Introduction If more than one option is being installed, read the installation instru

Seite 63

Hardware options installation 37 IMPORTANT: When either optional I/O expansion board is installed in a two-processor configuration, the second pro

Seite 64

Hardware options installation 38 6. Open the heatsink retaining bracket. CAUTION: Failure to completely open the processor locking lever preven

Seite 65

Hardware options installation 39 8. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle

Seite 66

Contents 4 Hardware options installation ... 36

Seite 67

Hardware options installation 40 9. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BO

Seite 68

Hardware options installation 41 10. Press the tabs on the processor installation tool to separate it from the processor, and then remove the tool.

Seite 69

Hardware options installation 42 12. Remove the heatsink protective cover. 13. Install the heatsink. 14. Close and lock the heatsink retaining br

Seite 70

Hardware options installation 43 Memory options This server contains eight memory cartridge connectors in the processor memory drawer. Each memory c

Seite 71

Hardware options installation 44 Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if curren

Seite 72

Hardware options installation 45 • The minimum configuration is two DIMMs per cartridge. Running in Lockstep mode, such DIMM pairs offer larger mem

Seite 73

Hardware options installation 46 o If the configuration is two quad-rank 8-GB DIMMs and six dual-rank 8-GB DIMMs in a single cartridge configuration

Seite 74 - Cabling

Hardware options installation 47 Memory subsystem architecture The Intel® Xeon® Processor E7 and 7500 processor memory architecture is designed to t

Seite 75 - Configuration tools

Hardware options installation 48 • In automatic mode, the BIOS enables Hemisphere mode if the system memory configuration is compatible with Hemisp

Seite 76 - Auto-configuration process

Hardware options installation 49 • The largest contributor to maximum memory bandwidth performance is to use both memory controllers inside the pro

Seite 77 - Configuring AMP modes

Contents 5 HP Insight Diagnostics survey functionality ... 82 I

Seite 78 - Array Configuration Utility

Hardware options installation 50 AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, t

Seite 79 - • Selecting the boot volume

Hardware options installation 51 However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 1A/8A pair l

Seite 80 - Management tools

Hardware options installation 52 4. Remove the processor memory drawer cover. 5. Remove the memory cartridge. 6. Open the memory cartridge cover

Seite 81 - USB support

Hardware options installation 53 8. Install the DIMM. See "Memory options (on page 43)." 9. Close the memory cartridge cover. 10. Insta

Seite 82 - Diagnostic tools

Hardware options installation 54 Drives should be the same capacity to provide the greatest storage space efficiency when drives are grouped togethe

Seite 83 - Keeping the system current

Hardware options installation 55 Redundant hot-plug power supply option The server supports up to four hot-plug power supplies. Install all power su

Seite 84 - HP Smart Update Manager

Hardware options installation 56 4. Connect the power cord to the power source. 5. Be sure that the power supply LED is green ("Power supply

Seite 85 - Care Pack

Hardware options installation 57 7. Install the SPI board. 8. Install the access panel. 9. Slide the server back into the rack. 10. Power up the

Seite 86 - Troubleshooting

Hardware options installation 58 5. Install the expansion board. 6. Install the shipping screw, if necessary. For more information, see "Secu

Seite 87 - Warnings and cautions

Hardware options installation 59 4. Remove the shipping screws. 5. Open the expansion board retainer.

Seite 88 - Symptom information

Contents 6 Acoustics statement for Germany (Geräuschemission) ... 110 W

Seite 89

Hardware options installation 60 6. Install the shipping screw. 7. Close the expansion slot retainer. 8. Install the access panel. 9. Slide the

Seite 90 - Loose connections

Hardware options installation 61 4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawer fro

Seite 91 - Troubleshooting flowcharts

Hardware options installation 62 7. Install the PCI Express I/O expansion board. 8. Install any expansion boards ("Installing a non-hot-plug

Seite 92 - General diagnosis flowchart

Hardware options installation 63 4. Release the latches on the release lever. 5. Lower the handle, and then extend the processor memory drawer fro

Seite 93

Hardware options installation 64 7. Install the PCI-X/PCI Express I/O expansion board. 8. Install any expansion boards ("Installing a non-hot

Seite 94 - Symptoms:

Hardware options installation 65 6. Install the mini-DIMM on the SPI board. 7. Install the SPI board. 8. Using a T-15 Torx screwdriver, remove th

Seite 95

Hardware options installation 66 10. Secure the 10G NIC connectors to the chassis with the retaining screw. 11. Install the RJ-45 plugs on the bot

Seite 96 - Troubleshooting 96

Hardware options installation 67 The BBWC consists of two parts: a battery pack and a storage cache module. Along with the cache module, the battery

Seite 97 - POST problems flowchart

Hardware options installation 68 6. Attach the cable to the cache module. 7. Install the battery. 8. Connect the cable to the battery. The SPI bo

Seite 98

Hardware options installation 69 CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM pinout. Do not use the cont

Seite 99 - OS boot problems flowchart

Component identification 7 Component identification Front panel components Item Description 1 Serial and PID tag 2 Optical drive 3 Systems Ins

Seite 100 - Troubleshooting 100

Hardware options installation 70 8. Connect the cable. 9. Install the capacitor pack. 10. Install the SPI board. 11. Install the access panel.

Seite 101 - • Redundancy failure

Hardware options installation 71 TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker Drive Enc

Seite 102 - (http://www.hp.com/support)

Hardware options installation 72 3. Extend the server from the rack (on page 25). 4. Remove the SPI board (on page 29). 5. Locate the TPM connecto

Seite 103 - Troubleshooting 103

Hardware options installation 73 Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9

Seite 104 - Battery replacement

Cabling 74 Cabling DVD-ROM drive cabling

Seite 105 - FCC rating label

Server software and configuration utilities 75 Server software and configuration utilities Configuration tools SmartStart software SmartStart is a c

Seite 106 - Modifications

Server software and configuration utilities 76 • Displaying system information • Selecting the primary boot controller • Configuring memory optio

Seite 107 - • EMC Directive 2004/108/EC

Server software and configuration utilities 77 For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD o

Seite 108 - Korean notice

Server software and configuration utilities 78 3. Select System Options. 4. Select Advanced Memory Protection. 5. Select Online Spare with Advance

Seite 109 - Battery replacement notice

Server software and configuration utilities 79 configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP

Seite 110 - Wireless devices

Component identification 8 Front panel LEDs and buttons Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server be

Seite 111 - Japanese notices

Server software and configuration utilities 80 Management tools Automatic Server Recovery ASR is a feature that causes the system to restart when a

Seite 112 - Taiwan notices

Server software and configuration utilities 81 For more information about iLO 3 features (which may require an iLO Advanced Pack or iLO Advanced for

Seite 113 - Electrostatic discharge

Server software and configuration utilities 82 Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool,

Seite 114 - Specifications

Server software and configuration utilities 83 Remote support and analysis tools HP Insight Remote Support software HP strongly recommends that you

Seite 115 - Specification Value

Server software and configuration utilities 84 For example: http://www.hp.com/support/dl360g6 (http://www.hp.com/support/dl360g6) Version control T

Seite 116 - Support and other resources

Server software and configuration utilities 85 HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers

Seite 117

Troubleshooting 86 Troubleshooting Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common

Seite 118 - Customer Self Repair

Troubleshooting 87 Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous condition

Seite 119

Troubleshooting 88 WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The

Seite 120 - Reparo feito pelo cliente

Troubleshooting 89 2. Record any error messages displayed by the system. 3. Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys. 4. Power

Seite 121

Component identification 9 Systems Insight Display The Systems Insight Display LEDs represent the server and component layout. LED Description

Seite 122

Troubleshooting 90 Breaking the server down to the minimum hardware configuration During the troubleshooting process, you may be asked to break the

Seite 123

Troubleshooting 91 • If problems continue to occur, remove and reinstall each device, checking the connectors and sockets for bent pins or other da

Seite 124 - Acronyms and abbreviations

Troubleshooting 92 Item See 5 "Server fault indications flowchart (on page 100)" General diagnosis flowchart The General diagnosis flo

Seite 125

Troubleshooting 93 Item See 3 "Service notifications (on page 91)" 4 The most recent version of a particular server or option firmware is

Seite 126

Troubleshooting 94 Server power-on problems flowchart Symptoms: • The server does not power on. • The system power LED is off or amber.

Seite 127 - Documentation feedback

Troubleshooting 95 • The external health LED is red or amber. • The internal health LED is red or amber. NOTE: For the location of server LED

Seite 128 - Index 128

Troubleshooting 96

Seite 129 - Index 129

Troubleshooting 97 POST problems flowchart Symptoms: • Server does not complete POST NOTE: The server has completed POST when the system att

Seite 130 - Index 130

Troubleshooting 98 Item See 13 • "Server information you need" in the HP ProLiant Servers Troubleshooting Guide located on the Documenta

Seite 131 - Index 131

Troubleshooting 99 OS boot problems flowchart Symptoms: • Server does not boot a previously installed operating system • Server does not boot Smar

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