HP Intel Xeon W3550 Spezifikationen

Document Number: 321461-001Intel® Xeon® Processor 3500 SeriesThermal / Mechanical Design GuideMarch 2009

Introduction10 Thermal/Mechanical Design Guide

Thermal/Mechanical Design Guide 11LGA1366 Socket2 LGA1366 SocketThis chapter describes a surface mount, LGA (Land Grid Array) socket intended for Int

LGA1366 Socket12 Thermal/Mechanical Design GuideFigure 2-2. LGA1366 Socket Contact Numbering (Top View of Socket) 31 29 27 25 23 21 19 1

Thermal/Mechanical Design Guide 13LGA1366 Socket2.1 Board LayoutThe land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad siz

LGA1366 Socket14 Thermal/Mechanical Design Guide2.2 Attachment to MotherboardThe socket is attached to the motherboard by 1366 solder balls. There are

Thermal/Mechanical Design Guide 15LGA1366 Socket2.3.3 ContactsBase material for the contacts is high strength copper alloy. For the area on socket con

LGA1366 Socket16 Thermal/Mechanical Design Guide2.4 Package Installation / RemovalAs indicated in Figure 2-6, access is provided to facilitate manual

Thermal/Mechanical Design Guide 17LGA1366 Socket2.5 DurabilityThe socket must withstand 30 cycles of processor insertion and removal. The max chain co

LGA1366 Socket18 Thermal/Mechanical Design Guide2.9 LGA1366 Socket NCTF Solder JointsIntel has defined selected solder joints of the socket as non-cri

Thermal/Mechanical Design Guide 19Independent Loading Mechanism (ILM)3 Independent Loading Mechanism (ILM)The Independent Loading Mechanism (ILM) prov

2 Thermal and Mechanical Design GuideINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY E

Independent Loading Mechanism (ILM)20 Thermal/Mechanical Design Guide3.1.2 ILM Back Plate Design OverviewThe back plate for single processor workstati

Thermal/Mechanical Design Guide 21Independent Loading Mechanism (ILM).Figure 3-2. ILM AssemblySocket Body with Back Plate on boardSocket Body Reflowed

Independent Loading Mechanism (ILM)22 Thermal/Mechanical Design GuideAs indicated in Figure 3-3, socket protrusion and ILM key features prevent 180-de

Thermal/Mechanical Design Guide 23LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications4 LGA1366 Socket and ILM Electrical,

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications24 Thermal/Mechanical Design Guide4.4 Loading SpecificationsThe socket

Thermal/Mechanical Design Guide 25LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications4.6 Environmental RequirementsDesign,

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications26 Thermal/Mechanical Design GuideA detailed description of this method

Thermal/Mechanical Design Guide 27Sensor Based Thermal Specification Design Guidance5 Sensor Based Thermal Specification Design GuidanceThe introducti

Sensor Based Thermal Specification Design Guidance28 Thermal/Mechanical Design Guide5.2 Sensor Based Thermal SpecificationThe sensor based thermal spe

Thermal/Mechanical Design Guide 29Sensor Based Thermal Specification Design GuidanceAs in previous product specifications, a knowledge of the system b

Thermal and Mechanical Design Guide 3Contents1Introduction...

Sensor Based Thermal Specification Design Guidance30 Thermal/Mechanical Design Guide5.3 Thermal Solution Design ProcessThermal solution design guidanc

Thermal/Mechanical Design Guide 31Sensor Based Thermal Specification Design GuidanceNote: If the assumed TAMBIENT is inappropriate for the intended sy

Sensor Based Thermal Specification Design Guidance32 Thermal/Mechanical Design Guide5.3.3 Thermal Solution Validation5.3.3.1 Test for Compliance to th

Thermal/Mechanical Design Guide 33Sensor Based Thermal Specification Design GuidanceNote: This data is taken from the validation of the RCBF5 referenc

Sensor Based Thermal Specification Design Guidance34 Thermal/Mechanical Design Guide5.4.1 Fan Speed Control Algorithm without TAMBIENT DataIn a system

Thermal/Mechanical Design Guide 35Sensor Based Thermal Specification Design Guidance5.4.2 Fan Speed Control Algorithm with TAMBIENT DataIn a system wh

Sensor Based Thermal Specification Design Guidance36 Thermal/Mechanical Design Guide5.5 System ValidationSystem validation should focus on ensuring th

Thermal/Mechanical Design Guide 37Sensor Based Thermal Specification Design Guidance5.6 Specification for Operation Where Digital Thermal Sensor Excee

Sensor Based Thermal Specification Design Guidance38 Thermal/Mechanical Design Guide

Thermal/Mechanical Design Guide 39ATX Reference Thermal Solution6 ATX Reference Thermal SolutionNote: The reference thermal mechanical solution inform

4 Thermal and Mechanical Design Guide6.4.1 Extrusion...426

ATX Reference Thermal Solution40 Thermal/Mechanical Design Guide6.2 Heatsink Thermal Solution AssemblyThe reference thermal solution for the processor

Thermal/Mechanical Design Guide 41ATX Reference Thermal Solution6.3 Geometric Envelope for the Intel® Reference ATX Thermal Mechanical DesignFigure 6-

ATX Reference Thermal Solution42 Thermal/Mechanical Design Guide6.4 Reference Design Components6.4.1 ExtrusionThe aluminum extrusion is a 51 fin 102 m

Thermal/Mechanical Design Guide 43ATX Reference Thermal Solution6.4.2 ClipStructural design strategy for the clip is to provide sufficient load for th

ATX Reference Thermal Solution44 Thermal/Mechanical Design Guide6.4.3 CoreThe core is the same forged design used in RCFH4. This allows the reuse of t

Thermal/Mechanical Design Guide 45ATX Reference Thermal SolutionFigure 6-6. Clip Core and Extrusion AssemblyFigure 6-7. Critical Parameters for Interf

ATX Reference Thermal Solution46 Thermal/Mechanical Design Guide6.6 Heatsink Mass and Center of Gravity• Total assembly mass ≤ 550 gm (grams), excludi

Thermal/Mechanical Design Guide 47Thermal Solution Quality and Reliability Requirements7 Thermal Solution Quality and Reliability Requirements7.1 Refe

Thermal Solution Quality and Reliability Requirements48 Thermal/Mechanical Design Guide7.2.2 Post-Test Pass CriteriaThe post-test pass criteria are:1.

Thermal/Mechanical Design Guide 49Component SuppliersA Component SuppliersNote: The part numbers listed below identifies the reference components. End

Thermal and Mechanical Design Guide 5B-6 Reference Design Heatsink Assembly (2 of 2) ... 57B

Component Suppliers50 Thermal/Mechanical Design Guide

Thermal/Mechanical Design Guide 51Mechanical DrawingsB Mechanical DrawingsTable B-1 lists the mechanical drawings included in this appendix.Table B-1.

Mechanical Drawings52 Thermal/Mechanical Design GuideFigure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top)8 7

Thermal/Mechanical Design Guide 53Mechanical DrawingsFigure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)HGFEDCBAHGFEDCBA8

Mechanical Drawings54 Thermal/Mechanical Design GuideFigure B-3. Socket / Processor / ILM Keepout Zone Primary Side (Top)

Thermal/Mechanical Design Guide 55Mechanical DrawingsFigure B-4. Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)

Mechanical Drawings56 Thermal/Mechanical Design GuideFigure B-5. Reference Design Heatsink Assembly (1 of 2)

Thermal/Mechanical Design Guide 57Mechanical DrawingsFigure B-6. Reference Design Heatsink Assembly (2 of 2)

Mechanical Drawings58 Thermal/Mechanical Design GuideFigure B-7. Reference Fastener Sheet 1 of 4

Thermal/Mechanical Design Guide 59Mechanical DrawingsFigure B-8. Reference Fastener Sheet 2 of 4

6 Thermal and Mechanical Design GuideRevision History§Revision NumberDescription Revision Date-001 • Initial release March 2009

Mechanical Drawings60 Thermal/Mechanical Design GuideFigure B-9. Reference Fastener Sheet 3 of 4

Thermal/Mechanical Design Guide 61Mechanical DrawingsFigure B-10. Reference Fastener Sheet 4 of 4

Mechanical Drawings62 Thermal/Mechanical Design GuideFigure B-11. Reference Clip - Sheet 1 of 28 7 6

Thermal/Mechanical Design Guide 63Mechanical Drawings§Figure B-12. Reference Clip - Sheet 2 of 21345678BCDA12345678BCDATHIS DRAWING CONTAINS INTEL COR

Mechanical Drawings64 Thermal/Mechanical Design Guide

Thermal/Mechanical Design Guide 65Socket Mechanical DrawingsC Socket Mechanical DrawingsTable C-1 lists the mechanical drawings included in this appen

Socket Mechanical Drawings66 Thermal/Mechanical Design GuideFigure C-1. Socket Mechanical Drawing (Sheet 1 of 4)

Thermal/Mechanical Design Guide 67Socket Mechanical DrawingsFigure C-2. Socket Mechanical Drawing (Sheet 2 of 4)

Socket Mechanical Drawings68 Thermal/Mechanical Design GuideFigure C-3. Socket Mechanical Drawing (Sheet 3 of 4)

Thermal/Mechanical Design Guide 69Socket Mechanical Drawings§Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4)

Thermal/Mechanical Design Guide 7Introduction1 IntroductionThis document provides guidelines for the design of thermal and mechanical solutions for th

Socket Mechanical Drawings70 Thermal/Mechanical Design Guide

Thermal/Mechanical Design Guide 71Processor Installation ToolD Processor Installation ToolThe following optional tool is designed to provide mechanica

Processor Installation Tool72 Thermal/Mechanical Design Guide§Figure D-1. Processor Installation Tool

Introduction8 Thermal/Mechanical Design Guide1.1 ReferencesMaterial and concepts available in the following documents may be beneficial when reading t

Thermal/Mechanical Design Guide 9Introduction§TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP