HP Intel Xeon W3550 Spezifikationen PDF herunterladen (Seite 3)

Thermal and Mechanical Design Guide 3

Contents

1Introduction..............................................................................................................7

1.1 References.........................................................................................................8

1.2 Definition of Terms..............................................................................................8

2 LGA1366 Socket ......................................................................................................11

2.1 Board Layout....................................................................................................13

2.2 Attachment to Motherboard ................................................................................14

2.3 Socket Components...........................................................................................14

2.3.1 Socket Body Housing..............................................................................14

2.3.2 Solder Balls...........................................................................................14

2.3.3 Contacts ...............................................................................................15

2.3.4 Pick and Place Cover...............................................................................15

2.4 Package Installation / Removal ........................................................................... 16

2.4.1 Socket Standoffs and Package Seating Plane..............................................16

2.5 Durability.........................................................................................................17

2.6 Markings..........................................................................................................17

2.7 Component Insertion Forces ...............................................................................17

2.8 Socket Size ......................................................................................................17

2.9 LGA1366 Socket NCTF Solder Joints.....................................................................18

3 Independent Loading Mechanism (ILM)...................................................................19

3.1 Design Concept.................................................................................................19

3.1.1 ILM Cover Assembly Design Overview.......................................................19

3.1.2 ILM Back Plate Design Overview............................................................... 20

3.2 Assembly of ILM to a Motherboard.......................................................................20

4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications .23

4.1 Component Mass...............................................................................................23

4.2 Package/Socket Stackup Height .......................................................................... 23

4.3 Socket Maximum Temperature............................................................................23

4.4 Loading Specifications........................................................................................ 24

4.5 Electrical Requirements......................................................................................24

4.6 Environmental Requirements ..............................................................................25

5 Sensor Based Thermal Specification Design Guidance.............................................. 27

5.1 Sensor Based Specification Overview ................................................................... 27

5.2 Sensor Based Thermal Specification..................................................................... 28

5.2.1 TTV Thermal Profile ................................................................................28

5.2.2 Specification When DTS value is Greater than TCONTROL ............................29

5.3 Thermal Solution Design Process.........................................................................30

5.3.1 Boundary Condition Definition.................................................................. 30

5.3.2 Thermal Design and Modelling..................................................................31

5.3.3 Thermal Solution Validation .....................................................................32

5.4 Fan Speed Control (FSC) Design Process ..............................................................33

5.4.1 Fan Speed Control Algorithm without TAMBIENT Data .................................34

5.4.2 Fan Speed Control Algorithm with TAMBIENT Data......................................35

5.5 System Validation ............................................................................................. 36

5.6 Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL........... 37

6 ATX Reference Thermal Solution.............................................................................. 39

6.1 Operating Environment ......................................................................................39

6.2 Heatsink Thermal Solution Assembly....................................................................40

6.3 Geometric Envelope for the Intel

Reference ATX Thermal Mechanical Design ........... 41

6.4 Reference Design Components............................................................................ 42

1 2 3 4 5 6 7 8 ... 71 72

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