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Thermal/Mechanical Design Guide 31

Sensor Based Thermal Specification Design Guidance

Note: If the assumed T

AMBIENT

is inappropriate for the intended system environment, the

thermal solution performance may not be sufficient to meet the product requirements.

The results may be excessive noise from fans having to operate at a speed higher than

intended. In the worst case this can lead to performance loss with excessive activation

of the Thermal Control Circuit (TCC).

Note: If an ambient of greater than 43.2 °C is necessary based on the boundary conditions a

thermal solution with a Ψ

lower than 0.19 °C/W will be required.

5.3.2 Thermal Design and Modelling

Based on the boundary conditions the designer can now make the design selection of

the thermal solution components. The major components that can be mixed are the

fan, fin geometry, heat pipe or air cooled solid core design. There are cost and acoustic

trade-offs the customer must make.

To aide in the design process Intel provides TTV thermal models. Please consult your

Intel Field Sales Engineer for these tools.

Figure 5-4. Required Ψ

for various T

AMBIENT

Conditions

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HP Intel Xeon W3550 Spezifikationen Seite 31