HP Intel Xeon W3550 Spezifikationen Seite 10
- Seite / 72
- Inhaltsverzeichnis
- LESEZEICHEN
- March 2009 1
- Contents 3
- Revision History 6
- 1 Introduction 7
- 1.1 References 8
- 1.2 Definition of Terms 8
- Introduction 10
- 2 LGA1366 Socket 11
- LGA1366 Socket 12
- 2.1 Board Layout 13
- 2.2 Attachment to Motherboard 14
- 2.3 Socket Components 14
- 2.3.3 Contacts 15
- 2.3.4 Pick and Place Cover 15
- 2.5 Durability 17
- 2.6 Markings 17
- 2.8 Socket Size 17
- 3 Independent Loading 19
- Figure 3-2. ILM Assembly 21
- Protrusion 22
- 4 LGA1366 Socket and ILM 23
- 4.4 Loading Specifications 24
- 4.5 Electrical Requirements 24
- 5 Sensor Based Thermal 27
- 5.2.1 TTV Thermal Profile 28
- TTV Power (W) 29
- Psi-ca System (BA) 33
- 5.5 System Validation 36
- Sensor Exceeds T 37
- 6 ATX Reference Thermal 39
- Reference ATX 41
- Thermal Mechanical Design 41
- 6.4.1 Extrusion 42
- 6.4.2 Clip 43
- Mechanism 44
- Core shoulder 45
- Dia 38.68 +/- 0.30mm 46
- Dia 36.14 +/- 0.10 mm 46
- Thermal Solution Quality and 47
- Reliability Requirements 47
- 7.2.2 Post-Test Pass Criteria 48
- A Component Suppliers 49
- Component Suppliers 50
- B Mechanical Drawings 51
- BOARD PRIMARY SIDE 52
- BOARD SECONDARY SIDE 53
- Mechanical Drawings 54
- C Socket Mechanical Drawings 65
- Socket Mechanical Drawings 66
- D Processor Installation Tool 71
- Processor Installation Tool 72
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