HP Compaq dc7900 USDT Spezifikationen PDF herunterladen (Seite 142)

and the remainder is assigned to single channel. For optimal speed, the channels should be

balanced so that the largest amount of memory is spread between the two channels. If one channel

will have more memory than the other, the larger amount should be assigned to Channel A. For

example, if you are populating the sockets with one 1-GB DIMM, and three 512-MB DIMMs,

Channel A should be populated with the 1-GB DIMM and one 512-MB DIMM, and Channel B should

be populated with the two 512-MB DIMMs. With this configuration, 2-GB will run as dual channel

and 512-MB will run as single channel.

●

In any mode, the maximum operational speed is determined by the slowest DIMM in the system.

Installing DIMMs

CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power to

drain before adding or removing memory modules. Regardless of the power-on state, voltage is always

supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding

or removing memory modules while voltage is present may cause irreparable damage to the memory

modules or system board. If you see an LED light on the system board, voltage is still present.

The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is

important to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation

resulting from having incompatible metals in contact with each other.

Static electricity can damage the electronic components of the computer or optional cards. Before

beginning these procedures, ensure that you are discharged of static electricity by briefly touching a

grounded metal object.

When handling a memory module, be careful not to touch any of the contacts. Doing so may damage

the module.

1. Prepare the computer for disassembly (Preparation for Disassembly on page 118).

2. Remove the access panel (

Computer Access Panel on page 125).

3. Rotate up the external drive bay housing and the power supply to access the memory module

sockets on the system board.

WARNING! To reduce risk of personal injury from hot surfaces, allow the internal system

components to cool before touching.

130 Chapter 8 Removal and Replacement Procedures Small Form Factor (SFF) Chassis

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HP Compaq dc7900 USDT Spezifikationen Seite 142