HP 450 Spezifikationen PDF herunterladen (Seite 104)

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel processor and a graphics subsystem with discrete memory.

● Thermal paste is used on the processor (1) and the heat sink section (2) that services it

● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that

services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel processor and a graphics subsystem with UMA memory.

96 Chapter 4 Removal and replacement procedures

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HP 450 Spezifikationen Seite 104