Hp DM4 Bedienungsanleitung PDF herunterladen (Seite 82)

4. Remove the fan/heat sink assembly (2).

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly (1), the processor (2) and the graphics processor (3) on the system board each time

the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all

surfaces before the fan/heat sink assembly is reinstalled.

The following illustration shows the locations for thermal material on systems with discrete

graphics subsystems.

NOTE: Steps 5 through 7 apply to computers with UMA subsystem memory on the system

board. Steps 1 through 4 apply to computers with discrete subsystem memory.

74 Chapter 4 Removal and replacement procedures

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Hp DM4 Bedienungsanleitung Seite 82