Hp ProLiant DL360 G7 Server Bedienungsanleitung Seite 22
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Operations 22
CAUTION: For proper cooling do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize
the amount of time the access panel is open.
1. Install the air baffle.
2. If removed, install the BBWC battery pack or the FBWC capacitor pack ("Installing the BBWC battery
pack or the FBWC capacitor pack" on page 57).
3. Install the access panel (on page 20).
4. Slide the server into the rack.
5. Power up the server (on page 18).
Remove the PCI riser board assembly
CAUTION: To prevent damage to the server or expansion boards, power down the server and
remove all AC power cords before removing or installing the PCI riser board assembly.
1. Power down the server (on page 18).
2. Extend the server from the rack (on page 18).
3. Remove the access panel (on page 20).
4. If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 20).
5. Remove the air baffle (on page 21).
6. Remove the PCI riser board assembly:
a. Disconnect external cables connected to any existing expansion boards.
b. Loosen the four PCI riser board assembly thumbscrews.
- HP ProLiant DL360 G7 Server 1
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Rear panel components 8
- Rear panel LEDs and buttons 9
- System board components 10
- Item Description 11
- DIMM slots 12
- System maintenance switch 12
- Systems Insight Display LEDs 13
- SAS and SATA device numbers 15
- SAS and SATA hard drive LEDs 16
- Fan modules 16
- T-10/T-15 Torx screwdriver 17
- Operations 18
- Remove the access panel 20
- Install the access panel 20
- Remove the air baffle 21
- Install the air baffle 21
- Operations 24 24
- Rack planning resources 25
- Optimum environment 26
- Power requirements 27
- Rack warnings 28
- Installing hardware options 28
- Registering the server 31
- Introduction 32
- Memory options 37
- DIMM identification 38
- Memory configurations 39
- Installing a DIMM 45
- Removing hard drive blanks 46
- Installing a SAS hard drive 48
- Hard drive blackplane option 51
- Remove all fan modules 53
- Controller options 55
- Installing the cache module 56
- Expansion board options 58
- PCI thermal - power option 60
- Cabling 68
- Cabling 69 69
- Cabling 70 70
- PCI power cabling 71
- Configuration tools 72
- Using RBSU 73
- Auto-configuration process 73
- Boot options 74
- BIOS Serial Console 74
- Configuring AMP modes 74
- Configuring lockstep memory 75
- Configuring mirrored memory 75
- Array Configuration Utility 76
- Management tools 77
- Erase Utility 78
- Diagnostic tools 79
- Integrated Management Log 80
- Keeping the system current 81
- ProLiant Support Packs 82
- Firmware 82
- HP Smart Update Manager 82
- Care Pack 83
- Troubleshooting 84
- Symbols on equipment 85
- Warnings and cautions 85
- Symptom information 86
- Loose connections 88
- Service notifications 89
- Server health LEDs 89
- Troubleshooting flowcharts 89
- General diagnosis flowchart 90
- Symptoms: 92
- Troubleshooting 94 94
- POST problems flowchart 95
- OS boot problems flowchart 97
- Troubleshooting 98 98
- • Redundancy failure 99
- (http://www.hp.com/support) 100
- System battery 101
- System battery 102 102
- FCC rating label 103
- Class A equipment 103
- Class B equipment 103
- Modifications 104
- • EMC Directive 2004/108/EC 105
- Japanese notice 106
- BSMI notice 106
- Korean notice 106
- Chinese notice 107
- Laser compliance 107
- Battery replacement notice 107
- Electrostatic discharge 109
- Specifications 110
- Specifications 114 114
- Technical support 115
- Technical support 116 116
- Customer Self Repair 117
- Technical support 118 118
- Reparo feito pelo cliente 119
- Technical support 120 120
- Technical support 121 121
- Technical support 122 122
- Acronyms and abbreviations 123
- Index 126 126
- Index 127 127
- Index 128 128
- Index 129 129
- Index 130 130
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