HP xw6000 Betriebsanweisung PDF herunterladen (Seite 34)

2–6 Hardware Reference Guide

Hardware Upgrades

DIMM Installation Guidelines

WARNING: To reduce the risk of personal injury from hot surfaces,

allow the internal system components to cool before touching.

WARNING: To reduce the risk of personal injury when replacing

or removing DIMMs, allow the module being removed from the

DIMM socket sufficient time to cool. DIMM temperatures can reach

212°F (100°C).

CAUTION: When handling a memory module, do not touch any of the

contacts. Doing so may damage the module.

CAUTION: Static electricity can damage the electronic components of

the workstation or option boards. Before beginning these procedures,

ensure that you are discharged of static electricity by briefly touching a

grounded metal object. Refer to Appendix E, “Electrostatic Discharge,” for

more information.

When installing DIMMs, follow these guidelines:

■

When installing additional memory modules, you must install

two DIMMs of identical type and speed into the unpopulated

memory sockets.

■

For proper system operation, if your system supports

DDR-SDRAM DIMMs, the DIMMs must be industry-standard

184-pin, Registered ECC PC 2100 266 MHz-compliant, 2.5 volt

DDR-SDRAM DIMMs. The DDR-SDRAM DIMMs must

support CAS Latency 2 or 2.5 (CL = 2 or CL = 2.5). They must

also contain the mandatory Joint Electronic Device Engineering

Council (JEDEC) Serial Presence Detect (SPD) information.

■

DIMMs must be installed correctly. Be sure to match the keyed

slot on the DIMM with the tab on the DIMM socket. Push the

DIMM down into the DIMM socket, ensuring that it is fully

inserted and properly seated and that the retaining arms are

locked in place.

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HP xw6000 Betriebsanweisung Seite 34