HP Computer Spezifikationen PDF herunterladen (Seite 90)

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

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Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it

Intel processor and UMA graphics (not Bay Trail)

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

AMD processor with discrete graphics

82 Chapter 4 Removal and replacement procedures

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HP Computer Spezifikationen Seite 90