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HP ProLiant DL785 Server Maintenance and
Service Guide Generation 5 and Generation
6
Maintenance and Service Guide
HP Part Number: AH233-9002A_ed7
Published: January 2010
Edition: 7
Seitenansicht 0
1 2 3 4 5 6 ... 89 90

Inhaltsverzeichnis

Seite 1 - Maintenance and Service Guide

HP ProLiant DL785 Server Maintenance andService Guide Generation 5 and Generation6Maintenance and Service GuideHP Part Number: AH233-9002A_ed7Publishe

Seite 2

normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con todala documentación relacionada y con el embalaje de envío. Si

Seite 3 - Table of Contents

• Obrigatória Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substituaessas peças, serão cobradas as despesas de transporte e

Seite 4 - 4 Table of Contents

12 Customer self repair

Seite 5 - Table of Contents 5

2 Illustrated Parts CatalogIn this section• “Mechanical components” (page 13)• “System components” (page 16)Mechanical componentsIMPORTANT: The list o

Seite 6

Customer self repair(Chapter 1 (page 7))Spare part numberAssembly part numberDescriptionItemMandatory1491911-001AH233-3417AFiller, memory airblocker (

Seite 7 - 1 Customer self repair

3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruchdes Kunden zu erfüllen, muss das Teil von einem HP Servic

Seite 8

System components16 Illustrated Parts Catalog

Seite 9

IMPORTANT: The list of part numbers is current and correct as of the publication of thedocument. Part numbers change often. Check the HP Partsurfer we

Seite 10 - Reparo feito pelo cliente

Customer self repair(Chapter 1 (page 7))Spare part numberAssembly partnumberDescriptionItemOptional2448405-001448208-001AMD Opteron 8356 2.3 GHz 75Wre

Seite 11 - Reparo feito pelo cliente 11

Customer self repair(Chapter 1 (page 7))Spare part numberAssembly partnumberDescriptionItemMandatory1404785-001375861-B2172 GB 10k SAS single port har

Seite 12 - 12 Customer self repair

© Copyright 2008–2010 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice. The only warranti

Seite 13 - 2 Illustrated Parts Catalog

2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces piècessont également conçues pour permettre au client d&

Seite 14

1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HPsubstitua essas peças, serão cobradas as despesas de tr

Seite 16 - System components

3 Removal and replacement proceduresIn this section• “Required tools” (page 23)• “Safety considerations” (page 23)• “Preparation procedures” (page 24)

Seite 17

To prevent electrostatic damage:• Avoid hand contact by transporting and storing products in static-safe containers.• Keep electrostatic-sensitive par

Seite 18

Power down the serverIMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.To power down the server:1. Shut down th

Seite 19

NOTE: The release latches will lock into place when the rails are fully extended.WARNING! To reduce the risk of personal injury, be careful when press

Seite 20 - 20 Illustrated Parts Catalog

5. Place the server on a sturdy, level surface.Removing the access panelWARNING! To reduce the risk of personal injury from hot surfaces, allow the dr

Seite 21 - System components 21

4. After installing hardware options, replace the access panel. Be sure that the panel is securelylocked into place before powering up the server.Medi

Seite 22

NOTE: The release latch does not need to be pressed to reinsert the media module.Front BezelTo remove the front bezel:1. Power down the server (“Power

Seite 23 - Safety considerations

Table of Contents1 Customer self repair...7Réparat

Seite 24 - Preparation procedures

1. Power down the server (“Power down the server” (page 25)).2. Press the release button.3. Open the lever.4. Grasp the lever and slide the processor

Seite 25 - Power down the server

CAUTION: The cell filler is required to be place in cells 3 – 6 in a four-processor configuration.CAUTION: Before starting this procedure, read the in

Seite 26

5. Remove the heatsink.6. Open the processor retaining latch and the processor socket retaining bracket.32 Removal and replacement procedures

Seite 27 - Removing the access panel

7. Using your fingers, remove the failed processor.8. If the processor has separated from the installation tool, carefully reinsert the processor inth

Seite 28 - Media module (SID assembly)

11. Close the processor retaining latch and the processor socket retaining bracket.34 Removal and replacement procedures

Seite 29 - Processor memory cell

12. Clean the old thermal grease from the heatsink with an alcohol swab. Allow the alcohol toevaporate before continuing.13. Apply all the new grease

Seite 30 - Processors

17. Install the processor memory cell into the server.18. Power up the server.DIMMsEach processor memory cell can hold two to eight DIMMs, At least on

Seite 31 - Processors 31

SAS hard drive blankTo remove a SAS hard drive blank:1. Squeeze the tabs on the front of the filler to release it from the slot in the drive bay.2. Pu

Seite 32 - 5. Remove the heatsink

To replace the component, reverse the removal procedure.DVD, CD drive or blankTo remove a DVD, CD drive or blank:1. Power down the server (“Power down

Seite 33 - Processors 33

3. Remove the power supply.To replace the component, reverse the removal procedure.Hot-plug fansThe server supports redundant hot-plug fans, each with

Seite 34

Re-entering the server serial number and product ID...48System battery...

Seite 35 - Processors 35

2. Pull on the fan tray release bar, pull the fan housing unit straight out from the rear of thechassis until it stops, and tilt the tray down to expo

Seite 36

5. Pull the fan straight up and out of the chassis.IMPORTANT: Remove and replace only one fan at a time. If the system detects two fanfailures, the se

Seite 37 - SAS hard drives

To replace the component, reverse the removal procedure.Expansion boardsPCIe I/O backplaneDescriptionItemPCI Express x8 non-hot-plug expansion slot 11

Seite 38 - Power supply

PCIe I/O backplaneDescriptionItemPCI Express x4 non-hot-plug expansion slot 48PCI Express x4 non-hot-plug expansion slot 39PCI Express x4 non-hot-plug

Seite 39 - Hot-plug fans

2. Extend or remove the server from the rack (“Extending the server from the rack” (page 25)or “Removing the server from the rack” (page 26)).3. Remov

Seite 40

CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detachingthe cable causes any unsaved data in the cache module to

Seite 41 - Expansion slot covers

3. Remove the access panel (“Removing the access panel” (page 27)).CAUTION: To prevent a server malfunction or damage to the equipment, do not add orr

Seite 42 - Expansion boards

IMPORTANT: The battery pack might have a low charge when installed. In this case, a POSTerror message displays when the server is powered up, indicati

Seite 43

To replace the component, reverse the removal procedure.SPI (core I/O) boardThe System Peripheral Interconnect (SPI) board implements all the logic to

Seite 44 - SAS backplane

1. Power down the server (“Power down the server” (page 25)).2. Extend or remove the server from the rack (“Extending the server from the rack” (page

Seite 45 - Removing the cache module

8 Technical support...83Before you contact HP...

Seite 46

8. Pull the I/O backplane assembly out of the chassis.To replace the component, reverse the removal procedure.Midplane boardCAUTION: Before starting t

Seite 47 - Power supply backplane

CAUTION: When removing the midplane board do not allow the lower connectors to touchthe chassis. Allowing the midplane board connectors to touch the c

Seite 49 - I/O backplane assembly

4 Diagnostic toolsIn this section• “SmartStart software” (page 53)• “SmartStart Scripting Toolkit” (page 53)• “HP Instant Support Enterprise Edition”

Seite 50 - Midplane board

server configuration process. This automated server configuration process cuts time from eachserver deployed, making it possible to scale server deplo

Seite 51 - Midplane board 51

ROMPaq utilityThe ROMPaq utility enables you to upgrade the system firmware (BIOS) or Lights-Out 100firmware. To upgrade the firmware, insert a ROMPaq

Seite 52

access to any authorized network client, sends alerts, and provides other server managementfunctions.Using iLO 2, you can:• Remotely power up, power d

Seite 53 - 4 Diagnostic tools

by default in the system ROM. HP hardware supports USB version 1.1 or 2.0, depending on theversion of the hardware.Legacy USB support provides USB fun

Seite 54 - HP ROM-Based Setup Utility

3. Reseat the remaining processors, rebooting after each installation to identify any failedprocessors.4. Replace the processor in socket 1.5. Replace

Seite 55 - Integrated Management Log

2. Bring the server to base configuration by removing all components that are not required bythe server to complete POST. This process can include rem

Seite 58 - Memory-related port 85 codes

5 Component identificationIn this section• “Front panel components” (page 61)• “Front panel LEDs and buttons” (page 63)• “System Insight Display LEDs”

Seite 59 - Miscellaneous port 85 codes

DescriptionItemHard drive bay 3 right8Hard drive bay 4 right9Hard drive bay 5 right10Hard drive bay 6 right11Hard drive bay 7 right12Hard drive bay 8

Seite 60

Front panel LEDs and buttonsStatusColorDescriptionItemUID button is not activatedOffUID button and LED1UID button is activated for serveridentificatio

Seite 61 - 5 Component identification

StatusColorDescriptionItemNIC not usedNOTE: Rear panel NIC can show linkor activity while in standby mode.OffNIC 2 LED5Linked to the networkSolid gree

Seite 62

system attributes. The System Insight Display LEDs identify components experiencing an error,event, or failure.CAUTION: Do not block airflow by pushin

Seite 63 - Front panel LEDs and buttons

ComponentLEDProcessorPROCESSOR/MEMORY BOARD XPROC XProcessor DIMM boardPROCESSOR/MEMORY BOARD XBOARD XSAS and SATA hard drive LEDsStatusColorDescripti

Seite 64 - System Insight Display LEDs

InterpretationFault/UID LED(amber/blue)Online/activity LED(green)The drive is online, but is not currently active.OffOnCAUTION: Do not remove the driv

Seite 65

DescriptionItemDIMM slot 6C6DIMM slot 7D7DIMM slot 8D8Processor socket9Rear panel componentsDescriptionItemNIC connector 11Keyboard connector2USB conn

Seite 66 - SAS and SATA hard drive LEDs

DescriptionItemFan 518Fan 619Rear panel LEDs and buttonsStatusLED ColorDescriptionItemActivatedSolid blueUID1Server remotely managedFlashing blueDeact

Seite 67

1 Customer self repairHP products are designed with many Customer Self Repair (CSR) parts to minimize repair timeand allow for greater flexibility in

Seite 68 - Rear panel components

Power supply LEDStatusColorNo ac powerOffac power; standby power onBlinking greenFull power on; normal operationSolid greenPower supply failureBlinkin

Seite 69 - Rear panel LEDs and buttons

DescriptionItemFan 14System maintenance switch SW65System maintenance switch SW16SPI Board7PCI Express x8 non-hot-plug expansion slot 118PCI Express x

Seite 70 - Internal components

Combo PCIe/HTx I/O backplaneDescriptionItemBlank slot3HyperTransport non-hot-plug expansion slot 84PCI Express x4 non-hot-plug expansion slot 75PCI Ex

Seite 71

FunctionSwitchDescriptionPositionSystem configuration can be changedOffConfiguration lock2System configuration is lockedOnReserved—Reserved3Reserved—R

Seite 72 - SPI board components

System maintenance switch (SW1)CAUTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and allsupported AMD Opteron six-core proces

Seite 73

Table 5-2 Battery health and BBWC status LED patterns (continued)InterpretationLED 4 patternLED 3 patternThe battery pack is below the minimum charge

Seite 74 - Battery pack LEDs

DescriptionItemFan 11Fan 22Fan 33Fan 44Fan 55Fan 6676 Component identification

Seite 75 - Fan locations

6 CablingIn this section• “Cabling overview” (page 77)• “BBWC cabling” (page 77)• “SAS and SATA hard drive cabling” (page 78)• “SAS expander cabling”

Seite 76

SAS and SATA hard drive cablingCAUTION: When routing cables, always be sure that the cables are not in a position where theycan be pinched or crimped.

Seite 77 - 6 Cabling

6. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2(“Expansion boards” (page 42)).7. Route and connect the cab

Seite 78 - SAS expander cabling

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selonvotre situation géographique. Si votre situation géog

Seite 79 - SAS expander cabling 79

TIP: For best cable management route the cable to SAS backplane 1 under the power cable atthe power supply backplane and the cable to SAS backplane 2

Seite 80 - 80 Cabling

7 SpecificationsIn this section• “Environmental specification” (page 81)• “Server specifications” (page 81)Environmental specificationValueSpecificati

Seite 81 - 7 Specifications

ValueSpecification47- 63 Hz47- 63 HzRated input frequency14A at 200 V ac24A at100 V acRated input current2800 W2400 WRated input power95548189BTUs per

Seite 82

8 Technical supportIn this section• “Before you contact HP” (page 83)• “HP contact information” (page 83)Before you contact HPBe sure to have the foll

Seite 84

A Acronyms and abbreviationsABEND abnormal endACU Array Configuration UtilityADU Array Diagnostics UtilityAMD Advanced Micro DevicesASR Automatic Serv

Seite 85 - A Acronyms and abbreviations

TMRA recommended ambient operating temperatureUID unit identificationUPS uninterruptible power systemUSB universal serial busVCA Version Control Agent

Seite 86 - VCA Version Control Agent

IndexAaccess panel, 27ASR (see Automatic Server Recovery (ASR))Automatic Server Recovery (ASR), 56Bbattery-backed write cachebattery pack, 45data reco

Seite 87

Rrackextending server from, 25removing server from, 26RBSU (HP ROM-Based Setup Utility), 54removal and replacement procedures, 23required tools, 23ROM

Seite 89

• Zwingend Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist.Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werd

Seite 90 - *AH233-9002A_ed7*

*AH233-9002A_ed7*Printed in the US

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