HP ProLiant DL560 Spezifikationen

HP ProLiant DL560 Gen8 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic too

Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over

Customer self repair 11 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas

Customer self repair 12

Customer self repair 13

Customer self repair 14

Illustrated parts catalog 15 Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5

Illustrated parts catalog 16 Item Description Spare part number Customer self repair (on page 5) 7 Rack mounting hardware — — a) Ball bearing ra

Illustrated parts catalog 17 2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes tambié

Illustrated parts catalog 18 System components Item Description Spare part number Customer self repair (on page 5) System components 12 Hot

Illustrated parts catalog 19 Item Description Spare part number Customer self repair (on page 5) o) 3.3-GHz Intel Xeon processor E5-4627 v2* 733

© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only war

Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5) k) 16-GB, PC3-14900R-13, dual-rank x4* 715274-0

Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5) 29 Mini-SAS storage cable* 699144-001 Mandatory1

Illustrated parts catalog 22 1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te verva

Removal and replacement procedures 23 Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-

Removal and replacement procedures 24 This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk o

Removal and replacement procedures 25 If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can

Removal and replacement procedures 26 2. Extend the server from the rack. 3. After performing the installation or maintenance procedure, slide the

Removal and replacement procedures 27 Access the Systems Insight Display To access the HP Systems Insight Display: 1. Press and release the panel.

Removal and replacement procedures 28 2. Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Release the

Removal and replacement procedures 29 Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the in

Contents 3 Contents Customer self repair ...

Removal and replacement procedures 30 5. If any full-length expansion boards are installed, do one of the following: o Remove the primary PCIe rise

Removal and replacement procedures 31 PCIe riser blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

Removal and replacement procedures 32 4. Remove the access panel ("Access panel" on page 29). 5. Disconnect any external cables that are

Removal and replacement procedures 33 8. Remove the secondary PCIe riser cage. To replace the component, reverse the removal procedure. PCIe riser

Removal and replacement procedures 34 8. Remove the PCIe riser board. To replace the component, reverse the removal procedure. Drive blank CAUT

Removal and replacement procedures 35 3. Remove the drive. To replace the component, reverse the removal procedure. Power supply blank Remove the

Removal and replacement procedures 36 WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply bla

Removal and replacement procedures 37 6. Disconnect the USB cable. 7. Remove the power supply backplane. To replace the component, reverse the re

Removal and replacement procedures 38 The server shuts down in the following temperature-related scenarios: • At POST and in the OS, HP iLO perform

Removal and replacement procedures 39 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from

Contents 4 System board ...

Removal and replacement procedures 40 2. Install the PCIe riser cage ("PCIe riser cage (primary)" on page 31). 3. Install the access pane

Removal and replacement procedures 41 IMPORTANT: If any cables in the front panel assembly need replacing, the entire front panel assembly must be

Removal and replacement procedures 42 1. Back up all data. 2. Close all applications. 3. Power down the server (on page 25). 4. Remove all power:

Removal and replacement procedures 43 10. If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the connect

Removal and replacement procedures 44 8. If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the connec

Removal and replacement procedures 45 o Double capacitor pack holder: To replace the component, reverse the removal procedure. Recovering data fro

Removal and replacement procedures 46 If the drives are migrated to different drive positions or there are volumes present in the recovery server, a

Removal and replacement procedures 47 Expansion boards Half-length expansion board WARNING: To reduce the risk of personal injury, electric shoc

Removal and replacement procedures 48 To remove the component: 1. Power down the server (on page 25). 2. Remove all power: a. Disconnect each pow

Removal and replacement procedures 49 a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Exten

Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow fo

Removal and replacement procedures 50 To replace the component: 1. Remove the thermal interface protective cover from the heatsink. 2. Install th

Removal and replacement procedures 51 8. Power up the server. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow

Removal and replacement procedures 52 7. Open each of the processor locking levers in the order indicated, and then open the processor retaining bra

Removal and replacement procedures 53 To replace the component: 1. Install the processor. Verify that the processor is fully seated in the processo

Removal and replacement procedures 54 3. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press

Removal and replacement procedures 55 6. Install the heatsink. 7. Install the air baffle ("Air baffle" on page 29). 8. Install the acce

Removal and replacement procedures 56 b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 25). 4. Remove th

Removal and replacement procedures 57 b. Disconnect each power cord from the server. 3. Extend the server from the rack (on page 25). 4. Remove th

Removal and replacement procedures 58 5. Remove the access panel ("Access panel" on page 29). 6. Remove the air baffle ("Air baffle&

Removal and replacement procedures 59 To replace the component: 1. Install the spare system board. 2. Open each of the processor locking levers i

Customer self repair 6 Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièc

Removal and replacement procedures 60 3. Remove the clear processor socket cover. Retain the processor socket cover for future use. 4. Install the

Removal and replacement procedures 61 CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the proces

Removal and replacement procedures 62 10. Install the heatsink. IMPORTANT: Install all components with the same configuration that was used on

Removal and replacement procedures 63 Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Pro

Cabling 64 Cabling SAS drive cabling

Cabling 65 FBWC cabling • SFF FBWC cabling • PCIe option Depending on the server configuration, you may need to remove the primary PCIe riser cag

Diagnostic tools 66 Diagnostic tools Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides proced

Diagnostic tools 67 HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 66) provides survey functionality that gathers criti

Diagnostic tools 68 USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support

Component identification 69 Component identification Front panel components Item Description 1 Video connector 2 Serial pull tab 3 USB connect

Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo s

Component identification 70 Item Description Status 1 NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network

Component identification 71 Item Description Status 2 NIC link/activity Off = No link to network. If the power is off, view the rear panel RJ-45

Component identification 72 Systems Insight Display LED and color Health LED System power LED Status Power supply (amber) Red Amber • Only one po

Component identification 73 8 Video connector 9 iLO connector 10 Serial connector 11 FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on ri

Component identification 74 Slot PCIe 3-slot riser cage* PCIe 2-slot x16 riser cage 5 - HL/FH PCIe2 or PCIe3** x8 (8,4,2,1) PCIe2 or PCIe3** x16

Component identification 75 Item Description 3 Processor 3 socket 4 Drive cage power connector 2 5 Processor 3 DIMM slots (1-6) 6 Systems Insight D

Component identification 76 Position Default Function S6 Off Off = No function On = ROM reads system configuration as invalid. S7 — Reserved S8

Component identification 77 DIMM slot locations DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use

Component identification 78 Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashin

Component identification 79 FBWC module LEDs (P222, P420, P421) The FBWC module has three single-color LEDs (one amber and two green). The LEDs are

Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt

Component identification 80 CAUTION: To avoid damage to server components, all fan modules must be installed in fan bays for any processor configu

Component identification 81 Storage and expansion diagram

Specifications 82 Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Ship

Specifications 83 Rated input current 9.1 A at 100 VAC 6.7 A at 200 VAC Maximum rated input power 897 W at 100V AC input 1321 W at 200V AC input Btu

Acronyms and abbreviations 84 Acronyms and abbreviations DDR double data rate FBWC flash-backed write cache iLO Integrated Lights-Out IML Integra

Acronyms and abbreviations 85 UID unit identification USB universal serial bus

Documentation feedback 86 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentat

Index 87 1 150W PCIe power cable 63 A AC power supply 35, 82 access panel 29 air baffle 29 B battery 56 blank, power supply 35 buttons

Index 88 M maintenance 23 management tools 66 mechanical components 15 mechanical specifications 82 N NIC connectors 72 O optical drive

Customer self repair 9 enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que ll