HP BladeSystem c3000 Enclosure technologies technology brief Abstract...
Values obtained from the BladeSystem Power Sizer tool are based on worst case loads and are intended for facility planning purposes only. Actual powe
Connecting with no power redundancy configured If no power redundancy is configured, the total power available is defined as the power available fro
server power consumption, checks it against the power cap goal, and, if necessary, adjusts server performance to maintain an average power consumptio
Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which interconnect fabrics are used. The right-h
Figure 11. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server
interconnect. Depending on the configuration requirements, additional mezzanine cards and interconnects can be populated in: • Mezzanine 1 and Inter
Figure 13 lists the available configurations for half-height devices installed in device bay N (1–8). Figure 13. Port mapping for HP BladeSystem c30
Full details about Virtual Connect technology are available in the technology brief entitled “HP Virtual Connect technology implementation for the HP
The Onboard Administrator aggregates up to eight iLO 2 ports in a c3000 Enclosure, simplifying cable management and providing a graphical interface t
• Cooling—The Onboard Administrator makes sure there is sufficient cooling capacity for the server blade or interconnect module by retrieving therma
Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack-mounted infrastructure. The c3000 Enclosure is
More information about the Insight Display is available in the technology brief entitled “Managing the HP BladeSystem c-Class” at this URL: http://h1
The enclosure link-down port connects to the enclosure link-up port on the enclosure below it. The enclosure link-up port connects to the enclosure l
Appendix A. Acronyms in text The following acronyms are used in the text of this document. Table A-1. Acronyms Acronym Acronym expansion AC Alterna
Appendix B. Fan, power supply, and device bay population guidelines Figure B-1. HP BladeSystem c3000 Enclosure – Fan population guidelines. For corr
Figure B-2. HP BladeSystem c3000 Enclosure – Power supply population guidelines Table B-1. Power supply placement Number of power supplies Power
Figure B-3. HP BladeSystem c3000 Enclosure – Full-height server blade device bay numbering. Full--height servers should be populated from bottom to
Figure B-5. The c3000 Enclosure is divided by sheet metal panels into 2 full-height zones. Each horizontal zone is divided vertically by a removable
27 When installing a companion blade (HP StorageWorks SB40c Storage Blade, HP PCI Expansion Blade, or HP StorageWorks Ultrium 448c Tape Blade), the c
For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem infor
Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures Enclosure c3000 c7000 Height 6U 10U Blade orientation Horizont
Figure 2. HP BladeSystem c3000 Enclosure – rear view HP Thermal Logic technologies with a variety of HP Thermal Logic onnect er view : t Scalabl
Active Cool fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the speci
HP PARSEC architecture HP Parallel Redundant Scalable Enclosure Cooling (PARSEC) architecture is a hybrid model for cooling that combines the best of
Figure 5. The c3000 Enclosure fan bay and device bay population guidelines Thermal Logic for the server blade and enclosure The server blade des
Figure 6. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Monit
Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies The new, high efficiency HP c3000 power supplies provide greater than 9
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