HP ProOne 400 G1 Hauptspezifikationen PDF herunterladen (Seite 24)

System Memory Support

The HP ProOne 400 G1 Business PC supports the 4th generation Intel® Core™ processor family. Based on a new PC

micro-architecture, the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub

(PCH). Unlike previous generations, the 4th generation Intel® Core™ processor includes an Integrated Memory Controller

(IMC). The IMC supports DDR3/DDR3L protocols with two independent, 64-bit wide channels each accessing one or two

DIMMs.

Two channels of DDR3/DDR3L unbuffered small outline dual in-line memory modules (SO-DIMM) with a maximum of

two DIMMs per channel

Single-channel and dual-channel memory organization modes

Data burst length of eight for all memory organization modes

Memory data transfer rates of up to 1600 MT/s; actual supported data transfer rate determined by the configured

processor.

64-bit wide channels

DDR3/DDR3L system memory I/O voltage of 1.5V

Theoretical maximum memory bandwidth of:

21.3 GB/s in dual-channel mode assuming 1333 MT/s

25.6 GB/s in dual-channel mode assuming 1600 MT/s

Platform Memory Support

The All-in-One supports up to two (2) industry-standard DDR3-SDRAM SO-DIMMs.

CAUTION:

You must shut down the computer and disconnect the power cord before adding or removing memory modules.

Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in

to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the

memory modules or system board.

NOTE:

For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be

available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

QuickSpecs

HP ProOne 400 G1 All-in-One PC (19.5” Non-Touch)

Technical Specifications – Memory

DA - 14700 Worldwide QuickSpecs — Version 1 — 1.8.2014

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HP ProOne 400 G1 Hauptspezifikationen Seite 24