HP 2133 Mini-Note Spezifikationen PDF herunterladen (Seite 77)

2. Remove the fan/heat sink (2).

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

and system board components. Thermal grease is used on the video chip (1) and the surface of

the fan/heat sink (1) that contacts the video chip. Thermal tape is used on the processor (2) and

the surface of the fan/heat sink (2) that contacts the processor. Replacement thermal material is

included with all fan/heat sink and system board spare part kits.

If you have model 2140, remove the fan/heat sink:

1. Remove the three Torx8 T8M2.0×6.0 screws (1) that secure the fan/heat sink to the system board.

Component replacement procedures 69

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HP 2133 Mini-Note Spezifikationen Seite 77