HP 8517B Bedienungsanleitung Seite 102

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Seitenansicht 101
7-4
HP 8517B S-Parameter Test Set Manual
HP 8517B Replaceable Parts
Table 7-3 Standard Abbreviations
A
A Across Flats, Acrylic, Air (Dry Method), Ampere
ADJ Adjust, Adjustment
ANSI American National Standards Institute (formerly USASI-ASA)
ASSY Assembly
AWG American Wire Gage
B
BCD Binary Coded Decimal
BD Board, Bundle
BE-CU Beryllium Copper
BNC Type of Connector
BRG Bearing, Boring
BRS Brass
BSC Basic
BTN Button
C
C Capacitance, Capacitor, Cold, Center Tapped, Cermet, Compression
CCP Carbon Composition Plastic
CD Cadmium, Card, Cord
CER Ceramic
CHAM Chamfer
CHAR Character, Characteristic, Charcoal
CMOS Complementary Metal Oxide Semi-conductor
CNDCT Conducting, Conductive, Conductivity, Conductor
CONT Contact, Continuous, Control, Controller
CONV Converter
CPRSN Compression
CUP-PT Cup point
D
D Deep, Depletion, Depth, Diameter, Direct Current
DA Darlington
DAP-GL Diallyl Phthalate Glass
DBL Double
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