HP 2312TU Technical Information PDF herunterladen (Seite 87)

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel Celeron processor.

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Thermal paste is used on the processor (1) and the heat sink section (2) that services it

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A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

Reverse this procedure to reassemble and install the fan/heat sink assembly.

Component replacement procedures 79

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HP 2312TU Technical Information Seite 87