HP 2312TU Technical Information PDF herunterladen (Seite 86)

●

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.

●

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that

services it

NOTE: The following illustration shows the replacement thermal material locations on a computer

model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.

78 Chapter 4 Removal and replacement procedures

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HP 2312TU Technical Information Seite 86