Hp PROLIANT ML330 G6 Bedienungsanleitung Seite 6
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Contents 6
Preventing electrostatic discharge............................................................................................................ 111
Grounding methods to prevent electrostatic discharge................................................................................ 111
Specifications........................................................................................................................... 112
Environmental specifications ................................................................................................................... 112
Mechanical specifications ...................................................................................................................... 112
Power supply specifications .................................................................................................................... 113
Technical support...................................................................................................................... 115
Before you contact HP............................................................................................................................ 115
HP contact information........................................................................................................................... 115
Customer Self Repair ............................................................................................................................. 115
Acronyms and abbreviations...................................................................................................... 123
Index....................................................................................................................................... 126
- HP ProLiant ML330 G6 Server 1
- User Guide 1
- Intended audience 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Rear panel components 9
- Rear panel LEDs and buttons 10
- System board components 11
- System maintenance switch 12
- System board LEDs 13
- DIMM slots 15
- DIMM identification 15
- SAS and SATA device numbers 17
- Item LED description Status 18
- Fan locations 19
- Operations 20
- Remove the access panel 21
- Install the access panel 22
- Remove the air baffle 22
- Configure the air baffle 22
- Remove the media bay blank 23
- Remove a bezel blank 24
- Remove the processor board 24
- Install the processor board 25
- Rack planning resources 28
- Optimum environment 28
- Temperature requirements 29
- Rack warnings 30
- Installing hardware options 31
- Setting up a tower server 31
- Setup 33 33
- Setup 34 34
- Registering the server 35
- Introduction 36
- Processor option 36
- Memory options 42
- Memory configurations 43
- Installing DIMMs 46
- Power supply configuration 47
- To install the component: 51
- Remove the hard drive blank 51
- Removable media devices 56
- Identifying guide screws 57
- SATA optical drive option 57
- USB tape drive option 59
- Expansion board options 62
- Installing expansion boards 63
- PCI-X extender board option 64
- Storage controller option 67
- SAS controller option 69
- Configuration and utilities 75
- HP ROM-Based Setup Utility 76
- Boot options 77
- BIOS Serial Console 77
- Configuring mirrored memory 77
- Array Configuration Utility 78
- Management tools 80
- HP Systems Insight Manager 81
- Management Agents 81
- Redundant ROM support 81
- Diagnostic tools 82
- Integrated Management Log 83
- Array Diagnostic Utility 83
- Keeping the system current 84
- ProLiant Support Packs 85
- Care Pack 86
- Troubleshooting 87
- Symbols on equipment 88
- Warnings and cautions 88
- Symptom information 89
- Loose connections 90
- Service notifications 91
- Troubleshooting flowcharts 91
- General diagnosis flowchart 92
- Item Refer to 93
- Troubleshooting 96 96
- POST problems flowchart 97
- OS boot problems flowchart 98
- Symptoms: 100
- • Redundancy failure 101
- Troubleshooting 102 102
- Battery replacement 103
- Battery replacement 104 104
- Class A equipment 105
- Class B equipment 105
- FCC rating label 105
- Modifications 106
- • EMC Directive 2004/108/EC 107
- Japanese notice 108
- BSMI notice 108
- Korean notice 108
- Chinese notice 109
- Laser compliance 109
- Battery replacement notice 109
- Electrostatic discharge 111
- Specifications 112
- Power supply specifications 113
- Technical support 115
- Technical support 116 116
- Customer Self Repair 117
- Technical support 118 118
- Reparo feito pelo cliente 119
- Technical support 120 120
- Technical support 121 121
- Technical support 122 122
- Acronyms and abbreviations 123
- Index 126 126
- Index 127 127
- Index 128 128
- Index 129 129
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