Hp HDX 16 Bedienungsanleitung Seite 95

  • Herunterladen
  • Zu meinen Handbüchern hinzufügen
  • Drucken
  • Seite
    / 146
  • Inhaltsverzeichnis
  • LESEZEICHEN
  • Bewertet. / 5. Basierend auf Kundenbewertungen
Seitenansicht 94
Removal and replacement procedures 4–60
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly, the system board,
and the processor each time the fan/heat sink assembly is removed:
Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
Thermal pads are used on various other system board components 5 and 7, and the sections of the
heat sink 6 and 8.
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.
Seitenansicht 94
1 2 ... 90 91 92 93 94 95 96 97 98 99 100 ... 145 146

Kommentare zu diesen Handbüchern

Keine Kommentare