Hp ProLiant DL580 G4 Server Bedienungsanleitung Seite 55
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Expansion board options 55
PCI Express mezzanine options
The PCI Express x4 mezzanine option adds support for two optional PCI Express x4 non-hot-plug
expansion slots in slots 1 and 2.
Item Description
1 PCI Express x4 non-hot-plug expansion slot 1
2 PCI Express x4 non-hot-plug expansion slot 2
The PCI Express x8 mezzanine option adds support for one optional PCI Express x8 non-hot-plug
expansion slot in slot 1.
Installing the PCI-X Hot Plug Mezzanine Option
1. Power down the server (on page 24).
2. Extend or remove the server from the rack ("Extending the server from the rack" on page 24).
3. Remove the access panel ("Removing the access panel" on page 26).
- User Guide 1
- Audience assumptions 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Front panel components 7
- Front panel LEDs and buttons 8
- • If the server is rebooted 9
- Processor module LEDs 11
- Rear panel components 12
- Rear panel LEDs and buttons 13
- Power supply LEDs 14
- System board components 15
- System maintenance switch 16
- Boot device selector switch 16
- Systems Insight Display LEDs 17
- DIMM slot locations 19
- SATA or SAS drive numbers 20
- SATA or SAS hard drive LEDs 20
- Fan locations 21
- Hot-plug fan LEDs 23
- Server operations 24
- • Diskette drive 25
- • Hard drives 25
- Removing the access panel 26
- Replacing hot-plug fans 27
- Removing the system cage 28
- Server operations 29 29
- Battery 30
- Remove the battery 31
- Server setup 32
- Rack planning resources 33
- Optimum environment 33
- Temperature requirements 34
- Power requirements 34
- Rack warnings and cautions 35
- Server setup 36 36
- Installing hardware options 37
- Registering the server 38
- Introduction 39
- Processor options 39
- Installing a processor 41
- 10. Install the PPM 44
- Battery-backed write cache 48
- Expansion board options 53
- 54
- Expansion board options 57 57
- Expansion board options 58 58
- Install the retaining clips 59
- Expansion board options 61 61
- Expansion board options 66 66
- Memory options 67
- Advanced ECC memory 68
- Online spare memory 69
- Hot-plug mirrored memory 70
- Hot-plug RAID memory 71
- Memory boards and DIMMs 72
- Memory options 73 73
- Memory options 74 74
- 3. Open the memory board 74
- Memory options 75 75
- 5. Close the memory board 75
- Memory options 77 77
- Configuring the memory 78
- POST memory test 79
- ROM-based diagnostics 79
- Selecting the AMP mode 79
- Memory options 80 80
- Server cabling 81
- BBWC cabling 82
- Server cabling 83 83
- Power switch cable assembly 84
- Server cabling 85 85
- Configuration tools 86
- HP ROM-Based Setup Utility 87
- Boot options 88
- BIOS Serial Console 88
- Array Configuration Utility 89
- Management tools 90
- HP Systems Insight Manager 91
- Management Agents 92
- Redundant ROM support 92
- USB support 92
- Diagnostic tools 93
- Keeping the system current 94
- ProLiant Support Packs 95
- Care Pack 95
- Electrostatic discharge 96
- Troubleshooting 97
- Symbols on equipment 98
- Warnings and cautions 98
- Symptom information 99
- Loose connections 100
- Service notifications 101
- Troubleshooting flowcharts 101
- General diagnosis flowchart 102
- Symptoms: 104
- Troubleshooting 106 106
- POST problems flowchart 107
- OS boot problems flowchart 108
- • Redundancy failure 111
- Troubleshooting 112 112
- Troubleshooting 113 113
- Troubleshooting 114 114
- Troubleshooting 115 115
- FCC rating label 116
- Class A equipment 117
- Class B equipment 117
- Modifications 118
- Japanese notice 119
- BSMI notice 119
- Korean notice 119
- Laser compliance 120
- Battery replacement notice 120
- Server specifications 122
- Specification Value 123
- Technical support 124
- Technical support 125 125
- Customer Self Repair 126
- Technical support 127 127
- Reparo feito pelo cliente 128
- Technical support 129 129
- Technical support 130 130
- Technical support 131 131
- Acronyms and abbreviations 132
- Index 136 136
- Index 137 137
- Index 138 138
- Index 139 139
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