Hp ProLiant DL580 G3 Server Bedienungsanleitung Seite 175
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Regulatory compliance notices 175
Korean notice A&B
Class A equipment
Class B equipment
Laser compliance
This product may be provided with an optical storage device (that is, CD or DVD
drive) and/or fiber optic transceiver. Each of these devices contains a laser that is
classified as a Class 1 Laser Product in accordance with US FDA regulations and
the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of
procedures other than those specified herein or in the laser
product's installation guide may result in hazardous radiation
exposure. To reduce the risk of exposure to hazardous radiation:
- User Guide 1
- Audience assumptions 2
- Contents 3
- Front panel components 10
- Front panel LEDs and buttons 11
- Processor module LEDs 15
- Rear panel components 16
- Rear panel LEDs and buttons 17
- Power supply LEDs 18
- System board components 20
- System maintenance switch 21
- Boot device selector switch 22
- DIMM slot locations 25
- SCSI IDs 26
- Duplex mode 27
- SATA or SAS IDs 29
- SATA or SAS hard drive LEDs 30
- Fan locations 32
- 33
- Hot-plug fan LEDs 34
- BBWC LEDs 35
- Server operations 37
- Server operations 39 39
- Removing the access panel 40
- Replacing hot-plug fans 41
- Removing the system cage 42
- Server operations 43 43
- Battery 44
- Server operations 45 45
- Server setup 47
- Rack planning resources 48
- Optimum environment 49
- Temperature requirements 50
- Power requirements 51
- Rack warnings and cautions 52
- Server setup 53 53
- Installing hardware options 54
- Server setup 55 55
- Registering the server 56
- Introduction 57
- Processor options 57
- Installing a processor 59
- 9. Install the PPM 62
- Removing a hard drive blank 63
- Battery-Backed Write Cache 73
- Expansion board options 77
- Plug expansion slots 79
- RILOE II Board 93
- Memory options 95
- Advanced ECC memory 97
- Online spare memory 99
- Hot-plug mirrored memory 100
- Memory options 101 101
- Hot-plug RAID memory 102
- Memory Boards and DIMMs 103
- Memory options 105 105
- 3. Open the memory board 106
- 5. Close the memory board 107
- 4. Open the memory board 109
- 6. Close the memory board 110
- Configuring the memory 111
- POST memory test 112
- ROM-based diagnostics 112
- Selecting the AMP mode 112
- Memory options 113 113
- Server cabling 115
- BBWC cabling 116
- RILOE II cabling 117
- Hot-plug SCSI drive cabling 117
- SCSI simplex mode 118
- SCSI duplex mode 118
- Server cabling 119 119
- USB cable assembly 120
- Power switch cable assembly 121
- Configuration tools 123
- SmartStart Scripting Toolkit 124
- HP ROM-Based Setup Utility 125
- Array Configuration Utility 128
- Management tools 130
- Erase Utility 133
- HP Systems Insight Manager 133
- Management Agents 134
- Redundant ROM support 134
- Diagnostic tools 135
- HP Insight Diagnostics 136
- Survey Utility 136
- Integrated Management Log 137
- Array Diagnostic Utility 137
- Keeping the system current 138
- Resource Paqs 139
- ProLiant Support Packs 139
- Care Pack 140
- Electrostatic discharge 141
- Troubleshooting 143
- Server diagnostic steps 144
- Important safety information 144
- Troubleshooting 145 145
- Warnings and cautions 146
- Troubleshooting 147 147
- Symptom information 148
- Service notifications 149
- Loose connections 149
- Diagnostic steps 150
- Troubleshooting 151 151
- General diagnosis flowchart 152
- Troubleshooting 153 153
- Power-on problems flowchart 154
- Troubleshooting 155 155
- POST problems flowchart 157
- OS boot problems flowchart 159
- Troubleshooting 161 161
- Troubleshooting 163 163
- Troubleshooting 165 165
- Other information resources 167
- FCC rating label 170
- Class A equipment 170
- Class B equipment 171
- Modifications 172
- Mouse compliance statement 172
- Japanese notice 174
- BSMI notice 174
- Korean notice A&B 175
- Laser compliance 175
- Battery replacement notice 176
- Server specifications 179
- Technical support 181
- Customer self repair 182
- Acronyms and abbreviations 183
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