Hp ProLiant DL385 G5p Server Bedienungsanleitung Seite 35
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Hardware options installation 35
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options
and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Processor option
The server supports single- and dual-processor operation.
CAUTION: To avoid damage to the processor and system board, only authorized personnel
should attempt to replace or install the processor in this server.
CAUTION: To help avoid damage to the processor and system board, do not install the
processor without using the processor installation tool.
CAUTION: To prevent possible server malfunction and damage, dual processor configurations
must contain processors with the same part number.
IMPORTANT: If upgrading processor speed, update the system ROM before installing the
processor.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function
properly.
To install an additional processor:
1. Power down the server (on page 20).
2. Extend the server from the rack (on page 20).
3. Remove the access panel (on page 21).
4. Remove the PCI riser cage (on page 22).
5. Remove the air baffle (on page 23).
- User Guide 1
- Intended audience 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Systems Insight Display LEDs 8
- Rear panel components 10
- Rear panel LEDs and buttons 11
- System board 12
- System board switches 13
- NMI functionality 14
- DIMM slots 14
- Hard drive numbering 15
- SAS and SATA hard drive LEDs 15
- PCI riser cage LEDs 16
- Battery pack LEDs 17
- Hot-plug fans 18
- Component identification 19 19
- Operations 20
- Remove the access panel 21
- Install the access panel 22
- Remove the PCI riser cage 22
- Install the PCI riser cage 23
- Remove the air baffle 23
- Hot-plug fan operation 26
- Operations 27 27
- Rack planning resources 28
- Optimum environment 29
- Temperature requirements 30
- Power requirements 30
- Rack warnings 31
- Installing hardware options 32
- Registering the server 34
- Introduction 35
- Processor option 35
- Install the heatsink 40
- Install the air baffle 40
- Memory configurations 44
- Installing DIMMs 45
- Expansion board options 48
- PCI riser board option 51
- Cabling 52
- Configuration and utilities 53
- HP ROM-Based Setup Utility 54
- Array Configuration Utility 55
- Management tools 57
- Erase Utility 58
- HP Systems Insight Manager 58
- Management Agents 58
- Redundant ROM support 59
- Diagnostic tools 60
- Array Diagnostic Utility 61
- Web-Based Enterprise Service 61
- Open Services Event Manager 61
- Keeping the system current 62
- Care Pack 63
- Troubleshooting 64
- Symbols on equipment 65
- Warnings and cautions 65
- Symptom information 66
- Loose connections 67
- Service notifications 68
- Troubleshooting flowcharts 68
- General diagnosis flowchart 69
- Item Refer to 70
- Symptoms: 71
- Troubleshooting 73 73
- POST problems flowchart 74
- OS boot problems flowchart 75
- • Redundancy failure 78
- Troubleshooting 79 79
- System battery 80
- FCC rating label 81
- Class A equipment 81
- Class B equipment 81
- Modifications 82
- • EMC Directive 2004/108/EC 83
- Japanese notice 84
- BSMI notice 84
- Korean notice 84
- Chinese notice 85
- Laser compliance 85
- Battery replacement notice 85
- Electrostatic discharge 87
- Specifications 88
- Technical support 90
- Technical support 91 91
- Customer Self Repair 92
- Technical support 93 93
- Reparo feito pelo cliente 94
- Technical support 95 95
- Technical support 96 96
- Technical support 97 97
- Acronyms and abbreviations 98
- Index 101 101
- Index 102 102
- Index 103 103
- Index 104 104
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