HP BL2x220c - ProLiant - G5 Server A Spezifikationen

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HP ProLiant BL2x220c Generation 5 Server
Blade
Maintenance and Service Guide
Part Number 468228-002
August 2008 (Second Edition)
Seitenansicht 0
1 2 3 4 5 6 ... 67 68

Inhaltsverzeichnis

Seite 1 - August 2008 (Second Edition)

HP ProLiant BL2x220c Generation 5 Server Blade Maintenance and Service Guide Part Number 468228-002 August 2008 (Second Edition)

Seite 2 - Intended audience

Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie word

Seite 3 - Contents

Customer self repair 11 Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segun

Seite 4 - Contents 4

Customer self repair 12

Seite 5 - Customer self repair

Customer self repair 13

Seite 6 - Customer self repair 6

Customer self repair 14

Seite 7 - Customer Self Repair

Customer self repair 15

Seite 8 - Customer self repair 8

Illustrated parts catalog 16 Illustrated parts catalog Server blade components Item Description Spare part number Customer self repair (on page 5

Seite 9

Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5) f) 2.66-GHz Intel® Xeon® model L5430 quad-core pr

Seite 10 - Reparo feito pelo cliente

Illustrated parts catalog 18 Item Description Spare part number Customer self repair (on page 5) g) HP NC373m PCI Express Dual Port Multifunction

Seite 11 - Customer self repair 11

Illustrated parts catalog 19 1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP q

Seite 12 - Customer self repair 12

© Copyright 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties

Seite 13 - Customer self repair 13

Illustrated parts catalog 20

Seite 14 - Customer self repair 14

Removal and replacement procedures 21 Removal and replacement procedures Required tools You need the following items for some procedures: • T-15 To

Seite 15 - Customer self repair 15

Removal and replacement procedures 22 CAUTION: When performing non-hot-plug operations, you must power down the server blade and/or the system. Ho

Seite 16 - Illustrated parts catalog

Removal and replacement procedures 23 Power down the server blade Before powering down the server blade for any upgrade or maintenance procedures, p

Seite 17

Removal and replacement procedures 24 3. Remove the server blade. 4. Place the server blade on a flat, level work surface. WARNING: To reduce

Seite 18

Removal and replacement procedures 25 5. Turn jackscrew 1 approximately six turns counterclockwise. 6. Turn jackscrew 2 counterclockwise until the

Seite 19

Removal and replacement procedures 26 WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system c

Seite 20

Removal and replacement procedures 27 DIMMs To remove the component: 1. Power down the server blade (on page 23). 2. Remove the server blade (on p

Seite 21 - Safety considerations

Removal and replacement procedures 28 4. Remove the failed heatsink. To replace the component: 1. Clean the old thermal grease from the processor

Seite 22 - Server blade preparation

Removal and replacement procedures 29 3. Install the heatsink. 4. Install the server B assembly ("Install server B assembly" on page 25)

Seite 23 - Remove the server blade

Contents 3 Contents Customer self repair...

Seite 24 - Remove server B assembly

Removal and replacement procedures 30 IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the server blade doe

Seite 25 - Hard drive

Removal and replacement procedures 31 6. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the proc

Seite 26

Removal and replacement procedures 32 3. Press down firmly until the processor installation tool clicks and separates from the processor, and th

Seite 27 - Heatsink

Removal and replacement procedures 33 4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal

Seite 28

Removal and replacement procedures 34 7. Install the heatsink. 8. Install the server B assembly ("Install server B assembly" on page 25)

Seite 29 - Processor

Removal and replacement procedures 35 6. Remove the battery tray. 7. Remove the cache batteries from the battery tray. To replace the component,

Seite 30

Removal and replacement procedures 36 4. Disconnect the battery cables from the battery packs. 5. Do one of the following: o If a heatsink blank

Seite 31

Removal and replacement procedures 37 5. Remove the mezzanine card. CAUTION: To prevent damage to the server blade, apply pressure over the mez

Seite 32

Removal and replacement procedures 38 10. Open the processor retaining latch and the processor socket retaining bracket. CAUTION: To avoid dama

Seite 33

Removal and replacement procedures 39 12. Remove the system board assembly. To replace the system board: 1. Install the spare system board. Be sur

Seite 34 - Cache module battery

Contents 4 Server A DIMM slots ...

Seite 35 - Battery cable

Removal and replacement procedures 40 a. Open the processor retaining latch and the processor socket retaining bracket. b. Remove the processor so

Seite 36 - Mezzanine card

Removal and replacement procedures 41 5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old ther

Seite 37 - Server A system board

Removal and replacement procedures 42 7. Apply all the grease to the top of the processor in one of the following patterns to ensure even distributi

Seite 38

Removal and replacement procedures 43 11. Record the server serial number and product ID. For the location of the serial number label, see "Ser

Seite 39

Removal and replacement procedures 44 8. Open the processor retaining latch and the processor socket retaining bracket. CAUTION: To avoid damag

Seite 40

Removal and replacement procedures 45 10. Remove the heatsink retainer from the server B assembly. 11. Remove the system board assembly. To repla

Seite 41

Removal and replacement procedures 46 1. Install the spare system board. 2. Install the heatsink retainer. 3. Prepare the processor socket on th

Seite 42

Removal and replacement procedures 47 a. Open the processor retaining latch and the processor socket retaining bracket. b. Remove the processor so

Seite 43 - Server B system board

Removal and replacement procedures 48 6. Close the processor retaining latch and the processor socket retaining bracket. 7. Clean the old ther

Seite 44

Removal and replacement procedures 49 8. Apply all the grease to the top of the processor in one of the following patterns to ensure even distributi

Seite 45 - To replace the system board:

Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow fo

Seite 46

Removal and replacement procedures 50 After you replace the system board, you must re-enter the server serial number and the product ID. 1. During

Seite 47

Removal and replacement procedures 51 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default

Seite 48

Cabling 52 Cabling BBWC battery cabling Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blad

Seite 49

Cabling 53 Accessing a server blade with local KVM For this configuration, a USB hub is not necessary. To connect additional devices, use a USB hub.

Seite 50 - System battery

Cabling 54 3. Connect a USB hub to one USB connector. 4. Connect the following to the USB hub: o USB CD/DVD-ROM drive o USB keyboard o USB mouse

Seite 51

Diagnostic tools 55 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving commo

Seite 52 - Cabling

Diagnostic tools 56 You can view recorded events in the IML in several ways, including the following: • From within HP SIM • From within Survey U

Seite 53

Component identification 57 Component identification Front panel components Item Description 1 Server B Power On/Standby button 2 Server B

Seite 54

Component identification 58 Front panel LEDs Item Description Status 1 Server B system power LED Green = On Amber = Standby (auxiliary pow

Seite 55 - Diagnostic tools

Component identification 59 Item Description Status 8 Server A system power LED Green = On Amber = Standby (auxiliary power available) Off = No p

Seite 56 - External USB functionality

Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces p

Seite 57 - Component identification

Component identification 60 System board components Server A system board components Item Description 1 Internal USB connector 2 Hard drive con

Seite 58 - Front panel LEDs

Component identification 61 Server B system board components Item Description 1 Hard drive connector 2 Processor socket 2 3 Processor socket 1

Seite 59 - Access components

Component identification 62 Server A DIMM slots Server B DIMM slots Mezzanine connector definitions Item PCIe support Server support Mezza

Seite 60 - System board components

Component identification 63 System maintenance switch Position Function Default 1 iLO 2 security override Off 2 Configuration lock Off 3 Reserv

Seite 61 - Item Description

Specifications 64 Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shippin

Seite 62 - Server B DIMM slots

Acronyms and abbreviations 65 Acronyms and abbreviations CSR Customer Self Repair FC Fibre Channel HBA host bus adapter HP SIM HP Systems Insight

Seite 63 - HP c-Class Blade SUV Cable

Acronyms and abbreviations 66 USB universal serial bus

Seite 64 - Specifications

Index 67 A access components 59 accessing servers 24 B battery 34, 50 battery pack, removing 36 buttons 57 C cables 35, 52 cables, batter

Seite 65 - Acronyms and abbreviations

Index 68 symbols on equipment 22 system board 37, 43, 60 system board battery 50 system board components 60 T temperature 64 temperature ra

Seite 66

Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richi

Seite 67 - Index 67

Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert wer

Seite 68 - Index 68

Customer self repair 9 Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la su

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