HP SL6000 Bedienungsanleitung

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HP ProLiant SL6000 Scalable System technology
technology brief
Abstract.............................................................................................................................................. 3
Mechanical design for extreme scale-out computing................................................................................. 3
HP ProLiant z6000 G6 chassis .......................................................................................................... 4
Rack and cabling options.................................................................................................................. 4
SL6000 server trays ......................................................................................................................... 5
HP ProLiant SL160z G6 server ....................................................................................................... 7
HP ProLiant SL170z G6 server ....................................................................................................... 8
HP ProLiant SL2x170z G6 server ................................................................................................... 9
Intel Xeon 5500 Series processor technology ........................................................................................ 10
Multi-level caches........................................................................................................................... 11
QuickPath Interconnect controller ..................................................................................................... 12
Hyper-Threading ............................................................................................................................ 12
Turbo Boost technology................................................................................................................... 13
Processor socket technology................................................................................................................ 13
Memory technologies ......................................................................................................................... 14
DDR3 memory enhancements .......................................................................................................... 14
Controlled fan speed .................................................................................................................. 14
Reduced operating voltage.......................................................................................................... 14
Unbuffered and registered DIMMs ................................................................................................... 15
I/O technologies ............................................................................................................................... 16
PCI Express technology................................................................................................................... 16
Serial ATA technology .................................................................................................................... 16
Networking technologies ................................................................................................................ 17
High Performance Computing technologies ....................................................................................... 17
Power and thermal technologies.......................................................................................................... 17
Power supply options...................................................................................................................... 18
Redundant power operation ............................................................................................................ 18
Management and deployment............................................................................................................. 20
Systems management and monitoring............................................................................................... 20
Power and thermal management with the Power Management Controller ............................................. 20
Remote management and control with ProLiant Onboard Administrator ................................................ 22
IPMI 2.0 and DCMI 1.0.................................................................................................................. 22
Server deployment ......................................................................................................................... 23
Data security technology with the Trusted Platform Module ..................................................................... 23
Summary .......................................................................................................................................... 23
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Inhaltsverzeichnis

Seite 1

HP ProLiant SL6000 Scalable System technology technology brief Abstract...

Seite 2

Because two server nodes are installed side-by-side, the front of the unit has twice as many ports and LEDs as the SL170z G6 server. Each server node

Seite 3 - Abstract

Multi-level caches Intel Xeon 5500 Series processors have a three-level cache hierarchy (Figure 9): • An on-core 64-kilobyte Level 1 cache, split in

Seite 4 - Rack and cabling options

QuickPath Interconnect controller Intel Xeon 5500 Series processors attain their performance potential through Intel QuickPath architecture (Figure 1

Seite 5 - SL6000 server trays

Turbo Boost technology Intel Turbo Boost Technology complements Hyper-Threading by increasing the performance of both multi-threaded and single-threa

Seite 6

Figure 12. Diagram showing how the processor installation tool simplifies installation Memory technologies Xeon 5500 Series processors connect dir

Seite 7

Unbuffered and registered DIMMs DDR3 DIMMs are available as both Unbuffered (UDIMMs) and Registered (RDIMMs). Both UDIMMs and RDIMMs support error co

Seite 8

For detailed memory configuration guidelines, use the Online DDR3 Memory Configuration Tool available on the HP website: www.hp.com/go/ddr3memory-con

Seite 9

throughput and improve the ability to locate and fix disk failures. More importantly, serial architecture solves the problems of clock skew and signa

Seite 10

Power supply options Common slot power supplies come in multiple power ratings and have achieved efficiency ratings of up to 92 percent. Three power

Seite 11 - Multi-level caches

Full AC or DC redundancy requires two power supplies to run the z6000 chassis. If one power supply fails and the remaining power supply can meet pow

Seite 12 - Hyper-Threading

Appendix: PPIC command line utility... 24 For more i

Seite 13 - Processor socket technology

In a multimode environment, it is important to ensure that planning is completed prior to selecting the right power supply for the desired redundancy

Seite 14 - Memory technologies

Figure 16. HP ProLiant z6000 G6 chassis node, fan, and power control block diagram Power control logic in the z6000 G6 chassis operates in one of

Seite 15

Remote management and control with ProLiant Onboard Administrator All ProLiant SL servers include ProLiant Onboard Administrator powered by LO100i.

Seite 16 - I/O technologies

Server deployment The HP ProLiant Easy Set-up CD provides easy, step-by-step, single- and multi-server server utilities to streamline server setup. I

Seite 17 - Networking technologies

24 Appendix: PPIC command line utility HP provides a simple command line utility, called PPIC, for reading and configuring the power control logic of

Seite 18 - Redundant power operation

For more information For additional information, refer to the resources listed below. Resource description Web address HP ProLiant SL160z G6 Server

Seite 19

Abstract The HP ProLiant SL6000 Scalable System implements an entirely new mechanical design and architecture in the industry-standard server market.

Seite 20 - Management and deployment

Figure 1. HP ProLiant SL6000 Scalable System HP ProLiant z6000 G6 chassis The HP ProLiant Scalable System implements a new chassis/rack architect

Seite 21

Figure 2. Front and rear views of HP 42U rack fully populated with SL6000 systems SL6000 server trays HP developed multiple SL6000 server trays to

Seite 22 - IPMI 2.0 and DCMI 1.0

For easy servicing, video and serial ports, USB ports, NIC ports, and optional out-of-band management LAN ports are located on the front panel of eac

Seite 23 - Summary

HP ProLiant SL160z G6 server The SL160z G6 server tray is optimized for maximum expansion (Figure 5). The system board accommodates up to two Intel X

Seite 24

HP ProLiant SL170z G6 server The HP ProLiant SL170z G6 server tray is optimized for maximum storage capability (Figure 6). It supports LFF, SFF, or S

Seite 25 - Call to action

HP ProLiant SL2x170z G6 server The HP ProLiant SL2x170z G6 server tray is optimized for compute power and density (Figure 7). It contains two SL170z

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