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HP ProLiant BL685c G7 Server Blade
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardwar
e components and
software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in
recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 593958-005
November 2013
Edition: 5
Seitenansicht 0
1 2 3 4 5 6 ... 66 67

Inhaltsverzeichnis

Seite 1

HP ProLiant BL685c G7 Server Blade Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnosti

Seite 2

Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over

Seite 3 - Contents

Customer self repair 11 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas

Seite 4 - Contents 4

Customer self repair 12

Seite 5 - Customer self repair

Customer self repair 13

Seite 6 - Customer self repair 6

Customer self repair 14

Seite 7 - Customer Self Repair

Illustrated parts catalog 15 Illustrated parts catalog Server blade components Item Description Spare part number Customer self repair (on page

Seite 8 - Customer self repair 8

Illustrated parts catalog 16 p) 2.2-GHz 16C AMD Opteron Model 6274* ** 662835-001 Optional2 q) 2.3-GHz 16C AMD Opteron Model 6276* ** 662834-001

Seite 9

Illustrated parts catalog 17 i) 200-GB, SAS, SSD, SFF, HP SLC 632627-001 Mandatory1 j) 200-GB, SAS, SSD, SFF, HP MLC 632633-001 Mandatory1 k) 3

Seite 10 - Reparo feito pelo cliente

Illustrated parts catalog 18 d) QLogic QMH2562 8Gb FC HBA for HP c-Class BladeSystem 455869-001 Mandatory1 e) Brocade 804 8Gb FC HBA for HP c-Clas

Seite 11 - Customer self repair 11

Illustrated parts catalog 19 a) HP Smart Array P410i Controller and cache module capacitor pack 598256-001 Mandatory1 b) HP Smart Array P410i 1-GB

Seite 12 - Customer self repair 12

© Copyright 2010, 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only war

Seite 13 - Customer self repair 13

Illustrated parts catalog 20 1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te verva

Seite 14 - Customer self repair 14

Removal and replacement procedures 21 Removal and replacement procedures Required tools You need the following items for some procedures: • T-15 To

Seite 15 - Illustrated parts catalog

Removal and replacement procedures 22 Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially

Seite 16

Removal and replacement procedures 23 • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications

Seite 17

Removal and replacement procedures 24 3. Remove the server blade. 4. Place the server blade on a flat, level work surface. WARNING: To reduce

Seite 18

Removal and replacement procedures 25 Hard drive blank Remove the component as indicated. To replace the component, reverse the removal procedure.

Seite 19

Removal and replacement procedures 26 DIMM baffle CAUTION: To avoid damage to the server blade and the enclosure, install all DIMM baffles in th

Seite 20

Removal and replacement procedures 27 5. Remove the DIMM. To replace the component, reverse the removal procedure. HP Smart Array Controller To re

Seite 21 - Safety considerations

Removal and replacement procedures 28 5. Remove the HP Smart Array Controller. To replace the component, reverse the removal procedure. Mezzanine

Seite 22 - Server blade preparation

Removal and replacement procedures 29 4. Remove the mezzanine card. To replace the component: CAUTION: To prevent damage to the server blade, a

Seite 23 - Remove the server blade

Contents 3 Contents Customer self repair ...

Seite 24 - Access panel

Removal and replacement procedures 30 3. Remove the access panel ("Access panel" on page 24). 4. Remove the cache module capacitor pack.

Seite 25 - Hard drive

Removal and replacement procedures 31 6. Remove the front panel/hard drive cage assembly. To replace the component, reverse the removal procedure.

Seite 26 - DIMM baffle

Removal and replacement procedures 32 6. Disconnect the SAS/SATA cable, the SGPIO cable, and the hard drive power cable from the hard drive backplan

Seite 27 - HP Smart Array Controller

Removal and replacement procedures 33 b. Remove the front panel/hard drive cage assembly ("Front panel/hard drive cage assembly" on page 3

Seite 28 - Mezzanine card

Removal and replacement procedures 34 3. Align and install the heatsink. Alternate tightening the screws until the heatsink is seated properly. 4.

Seite 29 - Cache module capacitor pack

Removal and replacement procedures 35 6. Open the processor socket retaining bracket and the processor locking lever. 7. Using the processor tool,

Seite 30

Removal and replacement procedures 36 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. H

Seite 31 - Hard drive backplane

Removal and replacement procedures 37 3. Press the tabs on the processor tool to release the processor, and then remove the processor tool. 4. Clo

Seite 32 - Heatsink

Removal and replacement procedures 38 6. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

Seite 33

Removal and replacement procedures 39 8. Align and install the heatsink. Alternate tightening the screws until the heatsink is seated properly. 9.

Seite 34 - Processor

Contents 4 USB support ...

Seite 35

Removal and replacement procedures 40 7. Remove the capacitor pack holder. 8. Remove the HP Smart Array controller ("HP Smart Array Controlle

Seite 36

Removal and replacement procedures 41 15. Using the processor tool, remove the processor from the system board. CAUTION: To avoid damage to the

Seite 37

Removal and replacement procedures 42 3. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. H

Seite 38

Removal and replacement procedures 43 5. Press the tabs on the processor tool to release the processor, and then remove the processor tool. 6. Clo

Seite 39 - System board

Removal and replacement procedures 44 IMPORTANT: Heatsinks for processors 1 and 2 are not interchangeable with the heatsinks for processors 3

Seite 40

Removal and replacement procedures 45 Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Pro

Seite 41

Removal and replacement procedures 46 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default

Seite 42

Cabling 47 Cabling Hard drive power cabling Hot-plug SAS/SATA hard drive cabling

Seite 43

Cabling 48 Cache module capacitor pack cabling Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform ser

Seite 44

Cabling 49 NOTE: For this configuration, a USB hub is not necessary. To connect additional devices, use a USB hub. 1. Connect the SUV cable to

Seite 45 - System battery

Customer self repair 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow fo

Seite 46

Cabling 50 NOTE: Use a USB hub when connecting a USB diskette drive and/or USB CD-ROM drive to the server blade. The USB hub provides additional

Seite 47 - Cabling

Diagnostic tools 51 Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving commo

Seite 48 - USB devices

Diagnostic tools 52 HP Insight Diagnostics HP Insight Diagnostics is a proactive server blade management tool, available in both offline and online

Seite 49

Diagnostic tools 53 HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure maximum system availabi

Seite 50 - Item Description

Diagnostic tools 54 For additional security, external USB functionality can be disabled through RBSU. Disabling external USB support in RBSU disable

Seite 51 - Diagnostic tools

Component identification 55 Component identification Front panel components Item Description 1 Hard drive bay 1 2 Hard drive bay 2 3 Server bla

Seite 52 - Array Diagnostic Utility

Component identification 56 Item Description Status Green flashing = Network activity Off = No link or activity 4 Flex 2 LED Green = Network link

Seite 53 - External USB functionality

Component identification 57 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and bl

Seite 54 - Internal SD support

Component identification 58 System board components Item Description 1 Processor socket 4 2 Processor 4 DIMM slots 3 Processor socket 1 (popul

Seite 55 - Component identification

Component identification 59 DIMM slot identification Each processor supports eight DIMM slots: • Processor 1 and processor 4 DIMM slots • Process

Seite 56 - SAS and SATA hard drive LEDs

Customer self repair 6 Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièc

Seite 57 - Interpretation

Component identification 60 System maintenance switch Position Function Default 1* iLO security override Off 2 Configuration lock Off 3 Reserve

Seite 58 - System board components

Component identification 61 Accessing the redundant ROM If the system ROM is corrupted, the system automatically switches to the redundant ROM in mo

Seite 59 - DIMM slot identification

Specifications 62 Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Non-

Seite 60 - System maintenance switch

Acronyms and abbreviations 63 Acronyms and abbreviations ADU Array Diagnostics Utility CSR Customer Self Repair ESD electrostatic discharge FC Fi

Seite 61 - HP c-Class Blade SUV Cable

Acronyms and abbreviations 64 SGPIO serial general input/output SIM Systems Insight Manager TPM Trusted Platform Module UID unit identification

Seite 62 - Specifications

Documentation feedback 65 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentat

Seite 63 - Acronyms and abbreviations

Index 66 A access panel 15, 24 accessing a server blade with local KVM 48, 49 ADU (Array Diagnostic Utility) 52 B batteries, replacing 45 ba

Seite 64 - Trusted Platform Module

Index 67 P Power On button 55 powering down 22 preparation procedures 22 processor tool 34, 39 processors 15, 34 R RBSU (ROM-Based Setup U

Seite 65 - Documentation feedback

Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo s

Seite 66 - Index 66

Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt

Seite 67 - Index 67

Customer self repair 9 enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que ll

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